Isiqulatho
1. Amagqabantshintshi kunye neMisebenzi enguNdoqo yeFOUP
2. Ulwakhiwo kunye noYilo lweempawu zeFOUP
3.Ukuhlelwa kunye neziKhokelo zokuSebenza zeFOUP
4. Ukusebenza kunye nokubaluleka kweFOUP kwiSemiconductor Manufacturing
5. Imingeni yobuGcisa kunye neeNdlela zoPhuhliso lwexesha elizayo
6.Izisombululo ezenzelwe wena zeXKH kunye neNkxaso yeNkonzo
Kwinkqubo yokwenziwa kwe-semiconductor, i-Front Opening Unified Pod (FOUP) sisikhongozeli esibalulekileyo esisetyenziselwa ukukhusela, ukuthutha, kunye nokugcina ii-wafers. Ingaphakathi layo lingakwazi ukuhlalisa amaqhekeza angama-25 e-300mm, kwaye amacandelo ayo aphambili abandakanya isitya sokuvula ngaphambili kunye nesakhelo socango esinikezelweyo sokuvula nokuvala. I-FOUP ingundoqo ophetheyo kwinkqubo yothutho ezenzekelayo ngaphakathi kwe-12inch wafer fabs. Iqhele ukuthuthwa kwindawo evaliweyo kwaye ivula kuphela xa ityhalelwe kwizibuko lomthwalo wesixhobo, ivumela iiwafers ukuba zigqithiselwe kwindawo yokulayisha/yokothula izixhobo.
Uyilo lweFOUP lulungelelaniswe kwiimfuno zemo engqongileyo encinci. Ineendawo zokubeka ngasemva ukuze kufakwe i-wafer, kwaye isiciko senzelwe ngokukodwa ukuhambelana ne-clamp yesivula. Iirobhothi eziphethe i-wafer zisebenza kwindawo yomoya ecocekileyo yeKlasi loku-1, ziqinisekisa ukuba ii-wafers azingcolisekanga ngexesha losulelo. Ngaphaya koko, iFOUP ihanjiswa phakathi kwezixhobo zenkqubo ngenkqubo yokuphatha izinto ezizenzekelayo (AMHS). Iilaphu zale mihla ezisicaba zisebenzisa iindlela zikaloliwe ezihamba phezulu kuthutho, ngelixa amalaphu ambalwa amadala anokusebenzisa izithuthi ezizisebenzelayo ezisekelwe emhlabeni (AGVs).
I-FOUP ayivumeli kuphela ukuhanjiswa kwe-wafer ezenzekelayo kodwa ikwasebenza nomsebenzi wokugcina. Ngenxa yamanyathelo okwenziwa amaninzi, iiwafers zinokuthatha iinyanga ukugqiba yonke inkqubo yokuhamba. Idityaniswe nomthamo ophezulu wenyanga wemveliso, oku kuthetha ukuba amashumi amawaka ee-wafers ngaphakathi kwelaphu ahlala esendleleni okanye egcinwe okwethutyana nangaliphi na ixesha. Ngexesha lokugcinwa, ii-FOUPs zicocwa ngamaxesha athile ngenitrogen ukuthintela ungcoliseko ekudibaneni neewafers, ukuqinisekisa inkqubo yemveliso ecocekileyo nethembekileyo.
1. Imisebenzi kunye nokubaluleka kweFOUP
Owona msebenzi we-FOUP kukukhusela iiwafers kumothuko wangaphandle kunye nokosuleleka, ngakumbi ukuthintela iimpembelelo kwisivuno ngexesha lokudluliselwa. Ikhusela ngokufanelekileyo ukufuma ngeendlela ezinje ngokucocwa kwegesi kunye noLawulo lweNdawo ye-Atmosphere (LAC), iqinisekisa ukuba ii-wafers zihlala zikwimo ekhuselekileyo ngelixa zilindele inyathelo elilandelayo lokuvelisa. Inkqubo yayo etywiniweyo kunye nelawulwayo ivumela kuphela iikhompawundi eziyimfuneko kunye nezixhobo ukuba zingene, ukunciphisa kakhulu imiphumo emibi ye-VOCs, i-oksijini, kunye nomswakama kwii-wafers.
Ekubeni i-FOUP elayishwe ngokupheleleyo ngee-wafers ze-25 inobunzima ukuya kwiikhilogram ze-9, ukuthuthwa kwayo kufuneka kuxhomekeke kwi-Automated Material Handling System (AMHS). Ukuququzelela oku, iFOUP iyilwe ngeendidi ezahlukeneyo zokudityaniswa kweepleyiti, izikhonkwane, kunye nemingxuma, kwaye ixhotyiswe ngeethegi ze-elektroniki ze-RFID ukuze zichongwe ngokulula kunye nokuhlelwa. Oku kuphathwa ngokuzenzekelayo kufuna phantse akukho msebenzi wezandla, ukunciphisa kakhulu amazinga eempazamo kunye nokuphucula ukhuseleko kunye nokuchaneka kwenkqubo yokuvelisa.
2. Ubume kunye noHlelo lweFOUP
Imilinganiselo eqhelekileyo yeFOUP imalunga nama-420 mm ububanzi, 335 mm ubunzulu, kunye nama-335 mm ubude. Amacandelo alo aphambili olwakhiwo abandakanya: i-OHT ephezulu (intloko ye-mushroom) yokuthutha i-overhead hoist transport; uMcango wangaphambili wokufikelela kwisixhobo esisicaba; Iziphatho ezisecaleni, ezihlala zikhowudi nemibala ukwahlula iindawo zenkqubo ezinamaqondo ahlukeneyo okungcoliseka; indawo yeKhadi yokubeka amakhadi omyalezo; kunye nethegi esezantsi ye-RFID esebenza njengeyona nto ibonakalisayo eyodwa yeFOUP, ivumela izixhobo kunye neehoists eziphezulu ukuba ziyiqaphele. Isiseko sikwaxhotyiswe ngemingxuma emine yokuchonga kunye nokubeka indawo yokuhambelana nezixhobo kunye neendawo zenkqubo yokwahlula.
Ngokusekwe ekusetyenzisweni, ii-FOUPs zihlelwe ngokweendidi ezintathu: i-PRD (yemveliso), i-ENG (yee-wafers zobunjineli), kunye ne-MON (ye-monitor wafers). I-PRD FOUPs ingasetyenziselwa ukuveliswa kwemveliso, iintlobo ze-ENG zifanelekile kwi-R & D okanye iimvavanyo, kunye neentlobo ze-MON zinikezelwe kwinkqubo yokubeka iliso kumanyathelo afana ne-CMP kunye ne-DIFF. Kubalulekile ukuba uqaphele ukuba i-PRD FOUPs ingasetyenziselwa zombini iinjongo ze-ENG kunye ne-MON, kunye neentlobo ze-ENG zingasetyenziselwa i-MON, kodwa umsebenzi ojikelezayo ubeka imingcipheko yekhwalithi.
Ihlelwe ngokwenqanaba lokungcoliseka, ii-FOUPs zinokwahlulwa zibe yi-FE FOUP (inkqubo yangaphambili, i-metal-free), YIBA FOUP (inkqubo yokubuyela emva, iqulethe isinyithi), kunye nezo zikhethekileyo kwiinkqubo zetsimbi ezithile ezifana ne-NI FOUP, CU FOUP, kunye ne-CO FOUP. IiFOUPs zeenkqubo ezahlukeneyo zidla ngokwahlulwa ngombala weziphatho zecala okanye iipaneli zocango. IiFOUPs ezivela kwiinkqubo zangaphambili zingasetyenziswa kwiinkqubo zasemva, kodwa i-FOUPs yangasemva mayingaze isetyenziswe kwiinkqubo zangaphambili, njengoko oku kungadala umngcipheko wongcoliseko.
Njengomthwali ophambili kwimveliso ye-semiconductor, i-FOUP, ngokusebenzisa i-automation ephezulu kunye nolawulo olungqongqo lokungcoliseka, iqinisekisa ukhuseleko kunye nokucoceka kwee-wafers ngexesha lenkqubo yokuvelisa, iyenza isiseko esiyimfuneko kwiifabhu zale mihla.
Ukuqukumbela
I-XKH izibophelele ekuboneleleni abathengi ngezisombululo ezilungiselelwe kakhulu ze-Front-Opening Unified Pod (FOUP), zibambelela ngokungqongqo kwiimfuno zakho zenkqubo ethile kunye neenkcukacha zojongano lwezixhobo. Ukusebenzisa itekhnoloji yemathiriyeli ephucukileyo kunye neenkqubo zokwenziwa ezichanekileyo, siqinisekisa ukuba yonke imveliso yeFOUP ihambisa umoya ongaqhelekanga, ucoceko, kunye nokuzinza koomatshini. Iqela lethu lobuchwephesha linobuchwephesha obunzulu boshishino, libonelela ngenkxaso ebanzi yomjikelo wobomi-ukusuka kudliwano-ndlebe olukhethiweyo kunye nokulungelelaniswa kwesakhiwo ukuya ekucoceni nasekugcinweni -ukuqinisekisa ukudityaniswa komthungo kunye nentsebenziswano esebenzayo phakathi kweFOUP kunye neNkqubo yakho yokuSebenza ngokuSebenzayo (AMHS) kunye nezixhobo zokusebenza. Sihlala sibeka phambili ukhuseleko lweewafers kunye nokwandiswa kwemveliso yemveliso, njengeenjongo zethu eziphambili. Ngeemveliso ezintsha kunye neenkonzo zobugcisa ezibandakanya zonke, sibonelela ngesiqinisekiso esinamandla kwiinkqubo zakho zokwenziwa kwe-semiconductor, ekugqibeleni sonyusa ukusebenza kakuhle kwemveliso kunye nemveliso yemveliso.
Ixesha lokuposa: Sep-08-2025