Yintoni iWafer Chipping kwaye Ingasonjululwa Njani?

Ukusikwa kwe-wafer yinkqubo ebalulekileyo ekuvelisweni kwee-semiconductor kwaye kunefuthe ngqo kumgangatho wokugqibela weetship kunye nokusebenza. Kwimveliso yokwenyani,ukutshiza i-wafer—ingakumbiukutshiza kwicala langaphambilikwayeukutshiza ngasemva—sisiphene esixhaphakileyo nesinzima esithintela kakhulu ukusebenza kakuhle kwemveliso kunye nesivuno. Ukuqhekeza akuchaphazeli nje kuphela ukubonakala kweetships kodwa kunokubangela umonakalo ongenakulungiseka ekusebenzeni kwazo kombane kunye nokuthembeka koomatshini.

Inkcazo kunye neentlobo zeWafer Chipping

Ukutshiza i-wafer kubhekisa kwiukuqhekeka okanye ukwaphuka kwezinto ezisemaphethelweni eetships ngexesha lenkqubo yokusikaNgokuqhelekileyo ihlulwe ngokwezigabaukutshiza kwicala langaphambilikwayeukutshiza ngasemva:

• Ukutshiza kwicala langaphambilikwenzeka kumphezulu osebenzayo wetshiphusi equlethe iipateni zesekethe. Ukuba ukutshiphusi kudlulela kwindawo yesekethe, kunokonakalisa kakhulu ukusebenza kombane kunye nokuthembeka kwexesha elide.

• Ukutshiza ngasemvaidla ngokuvela emva kokuncipha kwe-wafer, apho kuvela khona ukwaphuka emhlabeni okanye umaleko owonakeleyo ngasemva.

Ngokwembono yolwakhiwo,ukuqhekeka kwecala langaphambili kudla ngokubangelwa kukwaphuka kwe-epitaxial okanye iileya zomphezulu, ngelixaUkuqhekeka kwecala elingasemva kuvela kwiileya zomonakalo ezenziwe ngexesha lokuncitshiswa kwe-wafer kunye nokususwa kwezinto ze-substrate.

Ukutshiza ngaphambili kunokwahlulwahlulwa kathathu ngokweentlobo:

1. Ukutshipha kokuqala– ngokuqhelekileyo kwenzeka ngexesha lesigaba sangaphambi kokusikwa xa kufakwa i-blade entsha, ebonakala ngomonakalo ongaqhelekanga kumphetho.

2. Ukutshiza okwenziwa rhoqo (ngexesha elijikelezayo)– ivela ngokuphindaphindiweyo nangokuthe rhoqo ngexesha lemisebenzi yokusika eqhubekayo.

3. Ukutshiza okungaqhelekanga– okubangelwa kukuphelelwa ngamandla kweencakuba, izinga lokutya elingafanelekanga, ubunzulu bokusika obugqithisileyo, ukufuduka kwe-wafer, okanye ukuguquka.

Izizathu Eziphambili Zokuqhekeka Kwe-Wafer

1. Izizathu zokuqhekeka kokuqala

• Ukuchaneka kokufakwa kweblade akwanelanga

• Incakuba ayifakwanga kakuhle kwimo egqibeleleyo yesangqa

• Ukuvezwa kweenkozo zedayimani ezingaphelelanga

Ukuba i-blade ifakwe ngokuthambekela okuncinci, kuvela amandla okusika angalinganiyo. I-blade entsha engafakwanga kakuhle iya kubonisa ukuqina okungekuhle, nto leyo ekhokelela ekuphambukeni kwendlela yokusika. Ukuba iinkozo zedayimani azibonakali ngokupheleleyo ngexesha lesigaba sokusika kwangaphambili, izithuba ze-chip ezisebenzayo ziyasilela, nto leyo eyonyusa amathuba okuqhekeka.

2. Izizathu zokuCima iiChips rhoqo

• Umonakalo obangelwa ngumphezulu we-blade

• Amasuntswana edayimani amakhulu aphumayo

• Ukunamathela kwamasuntswana angaphandle (i-resin, inkunkuma yesinyithi, njl.njl.)

Ngexesha lokusika, ii-micro-notches zinokuvela ngenxa yokuchaphazeleka kwe-chip. Iinkozo ezinkulu zedayimani eziphumayo zigxininisa uxinzelelo lwendawo, ngelixa intsalela okanye ungcoliseko lwangaphandle kumphezulu weblade lunokuphazamisa ukuzinza kokusika.

3. Izizathu zokuqhekeka okungaqhelekanga

• Ukuphelelwa libala ngenxa yebhalansi engasebenzi kakuhle kwisantya esiphezulu

• Isantya sokutya esingafanelekanga okanye ubunzulu bokusika obugqithisileyo

• Ukufuduka kwe-wafer okanye ukuguqulwa kwayo ngexesha lokusika

Ezi zinto zikhokelela kumandla okusika angazinzile kunye nokuphambuka kwindlela yokusika esele imiselwe, nto leyo ebangela ngokuthe ngqo ukwaphuka komphetho.

4. Izizathu zokuqhekeka kwemilenze emva

Ukutshiza ngasemva kuvela ikakhuluukuqokelelwa koxinzelelo ngexesha lokuncitshiswa kwe-wafer kunye ne-warfage.

Ngexesha lokuncitshiswa, kwakheka umaleko owonakeleyo ngasemva, nto leyo ephazamisa isakhiwo sekristale kwaye ivelise uxinzelelo lwangaphakathi. Ngexesha lokusika, ukukhululwa koxinzelelo kukhokelela ekuqalisweni kwe-micro-crack, eqhubeka kancinci kancinci ibe zii-fractures ezinkulu ngasemva. Njengoko ubukhulu be-wafer buncipha, ukumelana kwayo noxinzelelo kuyancipha, kwaye i-warpage iyanda—okwenza ukuba i-backside chipping ibe nokwenzeka ngakumbi.

Impembelelo yeChipping kwiChips nakwiZinyathelo zokuThintela

Impembelelo ekusebenzeni kweChip

Ukutshiza kunciphisa kakhuluamandla oomatshini. Nokuba imifantu emincinci yomphetho ingaqhubeka nokwanda ngexesha lokupakisha okanye lokusetyenziswa ngokoqobo, ekugqibeleni ikhokelele ekuqhekekeni kweetshiphusi kunye nokusilela kombane. Ukuba ukuqhekeka kwecala langaphambili kungena kwiindawo zesekethe, kuyayichaphazela ngokuthe ngqo indlela esebenza ngayo umbane kunye nokuthembeka kwesixhobo ixesha elide.

Izisombululo ezisebenzayo zokuCima iWafer

1. Ukwenziwa ngcono kweParameter yeNkqubo

Isantya sokusika, isantya sokutya, kunye nobunzulu bokusika kufuneka zilungiswe ngokuguquguqukayo ngokusekelwe kwindawo ye-wafer, uhlobo lwezinto ezisetyenzisiweyo, ubukhulu, kunye nenkqubela phambili yokusika ukuze kuncitshiswe uxinzelelo.
Ngokudibanisaumbono womatshini kunye nokubeka esweni okusekelwe kwi-AI, imeko yeblade yexesha langempela kunye nokuziphatha kokutshixa kunokubonwa kwaye iiparameter zenkqubo zilungiswe ngokuzenzekelayo ukuze kulawulwe ngokuchanekileyo.

2. Ukugcinwa noLawulo lwezixhobo

Ukugcinwa rhoqo komatshini wokudaya kubalulekile ukuqinisekisa ukuba:

• Ukuchaneka kwe-Spindle

• Uzinzo lwenkqubo yokudlulisa

• Ukusebenza kakuhle kwenkqubo yokupholisa

Inkqubo yokujonga ubomi beblade kufuneka isetyenziswe ukuqinisekisa ukuba iiblade ezigugileyo ziyatshintshwa ngaphambi kokuba ukusebenza kwazo kunciphe.

3. Ukukhethwa kweBlade kunye noLungiso

Iimpawu zeblade ezifanaubungakanani bengqolowa yedayimani, ubulukhuni bebhondi, kunye nobuninzi bengqolowazinempembelelo enamandla kwindlela yokuziphatha kwe-chipping:

• Iinkozo zedayimani ezinkulu ziyandisa ukuqhekeka kwecala langaphambili.

• Iinkozo ezincinci zinciphisa ukuqhekeka kodwa zinciphisa ukusebenza kakuhle kokusika.

• Uxinano oluphantsi lweenkozo lunciphisa ukuqhekeka kodwa lunciphisa ubomi bezixhobo.

• Izinto ezithambileyo zokubopha ziyanciphisa ukuqhekeka kodwa ziyakhawuleza ukuguguleka.

Kwizixhobo ezisekelwe kwi-silicon,ubungakanani bengqolowa yedayimani yeyona nto ibalulekileyoUkukhetha iiblade ezikumgangatho ophezulu ezinomthamo omncinci weenkozo ezinkulu kunye nolawulo oluqinileyo lobungakanani beenkozo kuyayithintela ngempumelelo i-chips yangaphambili ngelixa kulawula iindleko.

4. Amanyathelo oLawulo lokuChipha i-Back-Side

Amaqhinga aphambili aquka:

• Ukuphucula isantya se-spindle

• Ukukhetha izinto zokuqhobosha zedayimani ezicolekileyo

• Ukusebenzisa izixhobo ezithambileyo kunye noxinzelelo oluphantsi lokurhawuzelela

• Ukuqinisekisa ukufakwa kweblade ngokuchanekileyo kunye nokungcangcazela okuzinzileyo kwe-spindle

Isantya esiphezulu okanye esiphantsi sokujikeleza kwandisa umngcipheko wokuqhekeka kwecala langasemva. Ukuthambeka kweblade okanye ukungcangcazela kwespindle kunokubangela ukuqhekeka kwecala langasemva elikhulu. Kwii-wafers ezincinci kakhulu,emva konyango olufana ne-CMP (Chemical Mechanical Polishing), ukugrumba okomileyo, kunye nokugrumba ngamakhemikhali amanzikunceda ukususa iileya zomonakalo ezishiyekileyo, ukukhulula uxinzelelo lwangaphakathi, ukunciphisa i-warpage, kunye nokuphucula kakhulu amandla eetship.

5. Iiteknoloji zokusika eziPhambili

Iindlela ezintsha zokunciphisa uxinezeleko oluncinci nezingenaxinzelelo zibonelela ngophuculo olongezelelekileyo:

• Ukusikwa nge-laserinciphisa ukudibana koomatshini kwaye inciphisa ukuqhekeka ngokusebenzisa ukucubungula amandla amaninzi.

• Ukusikwa kwamanzi ngejethiisebenzisa amanzi anoxinzelelo oluphezulu axutywe nezinto ezithintela ukubola, nto leyo enciphisa kakhulu uxinzelelo lobushushu nolwemishini.

Ukomeleza uLawulo loMgangatho kunye noHlolo

Inkqubo yokulawula umgangatho engqongqo kufuneka imiselwe kulo lonke uthotho lwemveliso—ukusuka ekuhlolweni kwezinto eziluhlaza ukuya ekuqinisekisweni kokugqibela kwemveliso. Izixhobo zokuhlola ezichanekileyo ezifanaiimayikroskopu ezibonakalayo kunye neemayikroskopu ze-electron zokuskena (i-SEM)kufuneka zisetyenziswe ekuhloleni ngokupheleleyo ii-wafers emva kokuzisika, nto leyo evumela ukufunyanwa kwangethuba kunye nokulungiswa kweziphene zokuqhekeka.

Isiphelo

Ukuqhekeza i-wafer sisiphoso esintsonkothileyo nesinezinto ezininzi esibandakanyaiiparameter zenkqubo, imeko yezixhobo, iipropati zeblade, uxinzelelo lwe-wafer, kunye nolawulo lomgangathoKuphela ngokulungiswa okucwangcisiweyo kuzo zonke ezi ndawo apho i-chipping ingalawulwa ngokufanelekileyo—ngaloo ndlela iphuculaimveliso evunyiweyo, ukuthembeka kweetship, kunye nokusebenza kwesixhobo ngokubanzi.