Iingenelo zeNgokusebenzisa iGlasi nge (TGV)kunye neenkqubo ze-Through Silicon Via(TSV) ngaphezulu kwe-TGV zezi:
(1) iimpawu zombane ezibalaseleyo ezisebenzisa i-high-frequency. Izinto zeglasi zizinto ezikhuselayo, i-dielectric constant imalunga ne-1/3 kuphela yezinto ze-silicon, kwaye i-loss factor iphantsi ngama-oda ama-2-3 ngobukhulu kunezinto ze-silicon, nto leyo eyenza ilahleko ye-substrate kunye nemiphumo ye-parasitic inciphe kakhulu kwaye iqinisekisa ukuthembeka kwesignali edluliselweyo;
(2)ubukhulu obukhulu kunye nesiseko seglasi esincinci kakhuluKulula ukuyifumana. I-Corning, i-Asahi kunye ne-SCHOTT kunye nabanye abavelisi beglasi banokubonelela ngeglasi yephaneli enkulu kakhulu (>2m × 2m) kunye neglasi encinci kakhulu (<50µm) kunye nezixhobo zeglasi eziguquguqukayo kakhulu.
3) Ixabiso eliphantsi. Zuza lula ukufikelela kwiglasi enkulu enobukhulu obuncinci kakhulu, kwaye ayifuni ukufakwa kweengqimba zokukhusela, iindleko zokuvelisa ipleyiti yeadaptha yeglasi zimalunga ne-1/8 kuphela yepleyiti yeadaptha esekelwe kwisilicon;
4) Inkqubo elula. Akukho mfuneko yokufaka umaleko wokukhusela phezu komphezulu we-substrate kunye nodonga lwangaphakathi lwe-TGV, kwaye akukho mfuneko yokuncitshiswa kwipleyiti ye-adapter encinci kakhulu;
(5) Uzinzo oluqinileyo loomatshini. Nokuba ubukhulu bepleyiti yeadaptha bungaphantsi kwe-100µm, i-warpage isencinci;
(6) Uluhlu olubanzi lwezicelo, yiteknoloji entsha yokudibanisa i-longitudinal esetyenziswa kwicandelo lokupakisha kwinqanaba le-wafer, ukufezekisa umgama omfutshane phakathi kwe-wafer-wafer, i-pitch encinci yokudibanisa inika indlela entsha yetekhnoloji, eneempawu zombane, ezishushu, zoomatshini, kwi-chip ye-RF, izinzwa ze-MEMS eziphezulu, ukuhlanganiswa kwenkqubo enoxinano oluphezulu kunye nezinye iindawo ezineenzuzo ezikhethekileyo, sisizukulwana esilandelayo se-chip ye-5G, i-6G ephezulu ye-chip ye-3D. Yenye yezona ndlela zokuqala zokupakisha i-3D ye-chips ye-5G kunye ne-6G ephezulu yesizukulwana esilandelayo.
Inkqubo yokubumba ye-TGV ibandakanya ikakhulu ukuqhushumba kwesanti, ukubhola nge-ultrasonic, ukugrumba okumanzi, ukugrumba okunzulu kwe-ion, ukugrumba okuthambileyo, ukugrumba nge-laser, ukugrumba okubangelwa yi-laser, kunye nokwakheka komngxuma wokukhupha inkunkuma.
Iziphumo zophando nophuhliso lwakutshanje zibonisa ukuba iteknoloji ingalungiselela ngemingxunya kunye nemingxuma eyi-5:1 engaboniyo enomlinganiselo wobunzulu nobubanzi obuyi-20:1, kwaye inesimo esihle. Ukugrumba okunzulu okubangelwa yilaser, okubangela uburhabaxa obuncinci bomphezulu, yeyona ndlela ifundwayo kakhulu okwangoku. Njengoko kubonisiwe kuMfanekiso 1, kukho imingxunya ecacileyo ejikeleze ukugrumba okuqhelekileyo kwelaser, ngelixa iindonga ezijikelezileyo kunye neendonga ezisemacaleni zokugrumba okunzulu okubangelwa yilaser zicocekile kwaye zigudile.
Inkqubo yokucubungulaI-TGVI-interposer iboniswe kuMfanekiso 2. Isicwangciso siphela kukugrumba imingxunya kwi-substrate yeglasi kuqala, uze emva koko ubeke umaleko wesithintelo kunye nomaleko wembewu eludongeni olusecaleni nakumphezulu. Umaleko wesithintelo uthintela ukusasazeka kwe-Cu kwi-substrate yeglasi, ngelixa ukwandisa ukunamathela kwezi zimbini, ewe, kwezinye izifundo kufumaniseke ukuba umaleko wesithintelo awuyomfuneko. Emva koko i-Cu ibekwa nge-electroplating, emva koko i-annealed, kwaye umaleko we-Cu ususwa yi-CMP. Ekugqibeleni, umaleko we-RDL rewiring ulungiswa yi-PVD coating lithography, kwaye umaleko we-passivation wenziwa emva kokuba iglu isusiwe.
(a) Ukulungiswa kwe-wafer, (b) ukwenziwa kwe-TGV, (c) i-electroplating enamacala amabini – ukufakwa kobhedu, (d) ukupholisha ngekhemikhali kunye noomatshini be-CMP, ukususwa komaleko wobhedu ongaphezulu, (e) ukugquma kwe-PVD kunye ne-lithography, (f) ukubekwa komaleko wokuphinda udibanise i-RDL, (g) ukususa iglu kunye nokugrumba kwe-Cu/Ti, (h) ukwenziwa komaleko wokudlulisa.
Ukushwankathela,iglasi edlula emngxunyeni (TGV)Amathuba okusetyenziswa kwezicelo abanzi, kwaye imakethi yasekhaya yangoku ikwinqanaba elikhulayo, ukusuka kwizixhobo ukuya kuyilo lwemveliso kunye nophando kunye nophuhliso izinga lokukhula liphezulu kunomndilili wehlabathi.
Ukuba kukho ukwaphulwa komthetho, qhagamshelana nathi ucime
Ixesha leposi: Julayi-16-2024