Nangona zombini ii-silicon kunye ne-glass wafers zabelana nenjongo efanayo "yokucocwa," imiceli mngeni kunye neendlela zokusilela abajongana nazo ngexesha lokucoca zahluke kakhulu. Oku kungafani kuvela kwiimpawu zezinto eziphathekayo kunye neemfuno zokuchazwa kwe-silicon kunye neglasi, kunye "nefilosofi" ecacileyo yokucoca eqhutywa zizicelo zabo zokugqibela.
Okokuqala, makhe sicacise: Yintoni kanye kanye esiyicocayo? Ziziphi izinto ezingcolisayo ezibandakanyekileyo?
Izinto ezingcolisayo zingahlelwa ngokweendidi ezine:
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I-Particle Contaminants
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Uthuli, iincinci zetsimbi, iinqununu zezinto eziphilayo, iinqununu ezinqabileyo (ukusuka kwinkqubo yeCMP), njl.
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Ezi zingcolisi zingabangela iziphene zepateni, ezifana neefutshane okanye iisekethe ezivulekileyo.
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Izingcolisi ze-Organic
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Ibandakanya iintsalela ze-photoresist, izongezo ze-resin, i-oyile yesikhumba somntu, iintsalela ze-solvent, njl.
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Ungcoliseko lwe-Organic lunokwenza iimaski ezithintela i-etching okanye i-ion implantation kunye nokunciphisa ukunamathela kwezinye iifilimu ezincinci.
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Izingcolisi zeMetal Ion
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Intsimbi, ubhedu, i-sodium, i-potassium, i-calcium, njl., ephuma kuqala kwizixhobo, iikhemikhali, kunye nokunxibelelana kwabantu.
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Kwii-semiconductors, i-ion zetsimbi "zii-killer" ezingcolisayo, ezizisa amanqanaba ombane kwi-band enqatshelwe, okwandisa ukuvuza kwangoku, ukunciphisa ixesha lokuphila komthuthi, kunye nokonakalisa kakhulu iipropati zombane. Kwiglasi, zinokuchaphazela umgangatho kunye nokunamathela kwiifilimu ezinqabileyo ezilandelayo.
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Uluhlu lweNative oxide
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Kwiziphaluka zesilicon: Umaleko obhityileyo wesilicon dioxide (Native Oxide) ngokwendalo kwakheka kumphezulu osemoyeni. Ubunzima kunye nokufana kolu luhlu lwe-oxide kunzima ukulawula, kwaye kufuneka lususwe ngokupheleleyo ngexesha lokwenziwa kwezakhiwo eziphambili ezifana nee-oxide zesango.
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Ngeentsimbi zeglasi: Iglasi ngokwayo sisakhiwo senethiwekhi ye-silica, ngoko ke akukho mcimbi "wokususa umaleko we-oxide wendalo." Nangona kunjalo, umphezulu unokuthi uguqulwe ngenxa yongcoliseko, kwaye olu maleko kufuneka lususwe.
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I. Iinjongo eziphambili: Ukwahlukana phakathi kokuSebenza koMbane kunye nokuPheliseka koMzimba
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Iziqwenga zeSilicon
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Injongo ephambili yokucoca kukuqinisekisa ukusebenza kombane. Iinkcukacha ngokuqhelekileyo ziquka ukubala kwamasuntswana angqongqo kunye nobukhulu (umzekelo, amasuntswana ≥0.1μm kufuneka asuswe ngokufanelekileyo), i-ion concentrations yensimbi (umzekelo, i-Fe, i-Cu kufuneka ilawulwe ukuya kwi-≤10¹⁰ athomu/cm² okanye ngaphantsi), kunye namanqanaba entsalela ye-organic. Nokuba ukungcoliseka kwe-microscopic kunokukhokelela kwiifutshane zesekethe, imisinga yokuvuza, okanye ukungaphumeleli kwengqibelelo ye-oxide yesango.
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IiWafers zeglasi
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Njengama-substrates, iimfuno eziphambili kukugqibelela komzimba kunye nokuzinza kweekhemikhali. Iinkcazo zigxininise kwiinkalo ze-macro-level ezifana nokungabikho kwemikrwelo, amabala angenakususwa, kunye nokugcinwa kobuqhetseba bokuqala kunye nejometri. Injongo yokucoca ngokuyinhloko kukuqinisekisa ukucoceka okubonakalayo kunye nokubambelela kakuhle kwiinkqubo ezilandelayo ezifana nokugubungela.
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II. Ubume beMaterial: Umahluko osisiseko phakathi kweCrystalline kunye neAmorphous
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Isilicon
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I-silicon yi-crystalline material, kwaye umphezulu wayo ngokwemvelo ukhula i-silicon dioxide (i-SiO₂) engalinganiyo yomaleko. Lo mgangatho we-oxide ubeka umngcipheko ekusebenzeni kombane kwaye kufuneka ususwe ngokucokisekileyo nangokulinganayo.
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Iglasi
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Iglasi yi-amorphous silica network. Izinto zayo ezininzi zifana nokubunjwa kwe-silicon oxide layer ye-silicon, oku kuthetha ukuba inokufakwa ngokukhawuleza nge-hydrofluoric acid (HF) kwaye iyakwazi ukukhukuliseka okunamandla kwe-alkali, okukhokelela ekwandeni koburhabaxa bomhlaba okanye ukuguqulwa. Lo mahluko usisiseko uyalela ukuba ukucocwa kwe-silicon wafer kunokunyamezela ukukhanya, ukufakwa okulawulwayo ukususa ungcoliseko, ngelixa ukucocwa kwe-wafer yeglasi kufuneka kwenziwe ngononophelo olukhulu ukunqanda ukonakalisa izinto ezisisiseko.
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| Into yokucoca | Ukucoca iSilicon Wafer | Ukucoca iWafer yeglasi |
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| Ukucoca Injongo | Ibandakanya umaleko wayo wendalo oxide | Khetha indlela yokucoca: Susa ukungcola ngelixa ukhusela izinto ezisisiseko |
| Ukucoca okusemgangathweni kwe-RCA | - SPM(H₂SO₄/H₂O₂): Susa iintsalela ze-organic/photoresist | Ukuhamba okuPhambili kokuCoca: |
| - SC1(NH₄OH/H₂O₂/H₂O): Susa amasuntswana omphezulu | I-ejenti yokucoca i-alkaline ebuthathaka: Iqulethe i-agent surface esebenzayo ukususa ukungcola kwezinto eziphilayo kunye namasuntswana | |
| - I-DHF(I-Hydrofluoric acid): Isusa umaleko we-oxide yendalo kunye nezinye izinto ezingcolisayo | I-alkaline eyomeleleyo okanye i-Arhente yokucoca i-alkaline ephakathi: Isetyenziselwa ukususa i-metallic okanye i-non-volatile contaminents | |
| - SC2(HCl/H₂O₂/H₂O): Isusa izinto ezingcolisa isinyithi | Kuphephe i-HF kulo lonke | |
| Imichiza engundoqo | Iiasidi ezinamandla, ii-alkali ezinamandla, i-solvents oxidizing | I-arhente yokucoca i-alkaline ebuthathaka, eyenzelwe ngokukodwa ukususwa kongcoliseko olungephi |
| Uncedo Lwenyama | Amanzi adiyiniweyo (ukuhlamba ucoceko oluphezulu) | Ultrasonic, ukuhlamba i-megasonic |
| Ukomisa iTekhnoloji | Megasonic, IPA ukomisa umphunga | Ukomisa ngobunono: Ukuphakamisa kancinci, ukomisa umphunga we-IPA |
III. Ukuthelekiswa kweZisombululo zokucoca
Ngokusekwe kwiinjongo ezikhankanywe ngasentla kunye neempawu zezinto eziphathekayo, izisombululo zokucoca i-silicon kunye neefestile zeglasi ziyahluka:
| Ukucoca iSilicon Wafer | Ukucoca iWafer yeglasi | |
|---|---|---|
| Injongo yokucoca | Ukususwa ngokucokisekileyo, kuquka umaleko we-oksidi wendalo wewafer. | Ukususwa okukhethiweyo: susa ukungcola ngelixa ukhusela i-substrate. |
| Inkqubo eqhelekileyo | Ucoceko lwe-RCA eqhelekileyo:•SPM(H₂SO₄/H₂O₂): isusa izinto eziphilayo ezinzima/i-photoresist •SC1(NH₄OH/H₂O₂/H₂O): ukususwa kwamasuntswana ealkaline •I-DHF(Dilute HF): isusa umaleko weoxide yendalo kunye neentsimbi •SC2(HCl/H₂O₂/H₂O): isusa ioni zetsimbi | Uphawu lokucoca ukuhamba:•Isicoci se-alkaline esiphakathikunye nezinto zokususa izinto eziphilayo kunye namasuntswana •Isicoci esine-Acidic okanye esingathathi hlangothiyokususa ii-ion zentsimbi kunye nezinye izingcolisi ezithile •Gwema i-HF kuyo yonke inkqubo |
| Iikhemikhali eziphambili | Iiasidi ezinamandla, ii-oxidizers ezinamandla, izisombululo ze-alkaline | Abacoci be-alkaline ephakathi; izicoci ezikhethekileyo ezingathathi hlangothi okanye ezineasidi kancinane |
| Uncedo ngokwasemzimbeni | I-Megasonic (ukusebenza okuphezulu, ukususwa kwamasuntswana athambileyo) | Ultrasonic, megasonic |
| Ukomisa | ukomisa iMarangoni; IPA ukomiswa komphunga | Ukomisa kancinci kancinci; IPA ukomiswa komphunga |
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Inkqubo yokucoca iWafer yeglasi
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Okwangoku, izityalo ezininzi zeglasi zisebenzisa iinkqubo zokucoca ngokusekelwe kwiimpawu zezinto zeglasi, zithembele ngokukodwa kwii-agent zokucoca i-alkaline ezibuthathaka.
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Iimpawu zeArhente yokucoca:Ezi arhente zokucoca zikhethekileyo zine-alkaline ebuthathaka, ene-pH ejikeleze i-8-9. Ngokuqhelekileyo ziqulethe i-surfactants (umzekelo, i-alkyl polyoxyethylene ether), i-metal chelating agents (umzekelo, i-HEDP), kunye nezixhobo zokucoca eziphilayo, ezenzelwe ukumisa kunye nokubola ukungcola kwezinto eziphilayo ezifana ne-oyile kunye neminwe yeminwe, ngelixa i-corrosive kancinane kwi-matrix yeglasi.
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Inkqubo yokuhamba:Inkqubo yokucoca eqhelekileyo ibandakanya ukusebenzisa i-concentration ethile ye-alkaline ebuthathaka yokucoca i-alkaline kwiqondo lokushisa ukusuka kwiqondo lokushisa ukuya kwi-60 ° C, idibene nokucoca i-ultrasonic. Emva kokucoca, iiwafers zithatha amanyathelo amaninzi okuhlamba ngamanzi acocekileyo kunye nokomisa kakuhle (umzekelo, ukuphakamisa okucothayo okanye ukomisa umphunga we-IPA). Le nkqubo ihlangabezana ngokufanelekileyo neemfuno zeglasi yokucoceka okubonakalayo kunye nococeko jikelele.
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Inkqubo yokucoca iSilicon Wafer
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Ukusetyenzwa kwe-semiconductor, ii-silicon wafers ngokuqhelekileyo zicocwa ngokwe-RCA esemgangathweni, eyindlela yokucoca esebenzayo kakhulu ekwaziyo ukujongana ngokucwangcisiweyo kuzo zonke iintlobo zongcoliseko, nokuqinisekisa ukuba iimfuno zokusebenza kombane kwizixhobo ze-semiconductor ziyafezekiswa.
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IV. Xa iGlass idibana neMigangatho "Yococeko" ePhakamileyo
Xa iiwafers zeglasi zisetyenziswa kwizicelo ezifuna ukubala kwamasuntswana angqongqo kunye namanqanaba e-ion yesinyithi (umzekelo, njenge substrates kwiinkqubo zesemiconductor okanye iindawo ezigqwesileyo zefilimu ezicekethekileyo zokubeka ifilimu), inkqubo yokucoca ngaphakathi inokungasakwazi ukwanela. Kule meko, imigaqo yokucoca i-semiconductor ingasetyenziswa, iqalise isicwangciso esilungisiweyo sokucoca i-RCA.
Undoqo wesi sicwangciso kukungcungcuthekisa kunye nokwandisa umgangatho wenkqubo ye-RCA iparameters ukulungiselela imo ebuthathaka yeglasi:
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Ukususwa kwezinto ezingcolisayo:Izisombululo ze-SPM okanye amanzi athambileyo e-ozone angasetyenziselwa ukubola ungcoliseko lwe-organic ngokusebenzisa i-oxidation enamandla.
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Ukususwa kweNcam:Isisombululo se-SC1 esixutywe kakhulu sisetyenziswa kumaqondo obushushu asezantsi kunye namaxesha amafutshane onyango ukusebenzisa i-electrostatic repulsion kunye ne-micro-etching iziphumo zokususa amasuntswana, ngelixa unciphisa ukubola kwiglasi.
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Ukususwa kwe-Metal ion:Isisombululo se-SC2 esihlanjululweyo okanye i-dilute elula ye-hydrochloric acid / i-dilute nitric acid izisombululo zisetyenziselwa ukususa i-metal contaminants nge-chelation.
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Izithintelo ezingqongqo:I-DHF (i-di-ammonium fluoride) mayiphetshwe ngokupheleleyo ukuze kuthintelwe ukubola kwenxalenye yeglasi.
Kuyo yonke inkqubo eguquliweyo, ukudibanisa iteknoloji ye-megasonic iphakamisa kakhulu ukususwa kokusebenza kwee-nano-size particles kwaye ithambile phezu komhlaba.
Ukuqukumbela
Iinkqubo zokucoca i-silicon kunye neewafers zeglasi ziziphumo ezingenakuthintelwa zobunjineli obubuyela umva ngokusekwe kwiimfuno zabo zokugqibela zesicelo, iipropathi zezinto eziphathekayo, kunye neempawu zomzimba kunye neekhemikhali. Ukucoca iwafer ye-silicon kufuna "ukucoceka kwinqanaba le-atomic" ekusebenzeni kombane, ngelixa ukucocwa kwe-wafer yeglasi kugxile ekufezekiseni indawo "egqibeleleyo, engonakalanga". Njengoko ii-wafers zeglasi zisanda kusetyenziswa kwizicelo ze-semiconductor, iinkqubo zabo zokucoca ngokuqinisekileyo ziya kuvela ngaphaya kokucocwa kwe-alkaline ebuthathaka, ukuphuhlisa izisombululo ezisulungekileyo, ezilungiselelwe njengenkqubo ye-RCA elungisiweyo ukuhlangabezana nemigangatho ephezulu yokucoceka.
Ixesha lokuposa: Oct-29-2025