Impumelelo Enkulu kwiTekhnoloji ye-Silicon Carbide Wafer Laser Lift-Off ye-12-intshi

Isiqulatho

1.​​Impumelelo Enkulu kwiTekhnoloji yokuphakamisa iLaser ye-Silicon Carbide Wafer ye-12-Inch​

2.​Iintsingiselo ezininzi zempumelelo yobuchwepheshe kuphuhliso lweShishini le-SiC​

3. Amathemba Exesha Elizayo: Uphuhliso Olupheleleyo lwe-XKH kunye neNtsebenziswano yoShishino​

Kutshanje, iBeijing Jingfei Semiconductor Technology Co., Ltd., umenzi wezixhobo ze-semiconductor zasekhaya ophambili, wenze inkqubela phambili ebalulekileyo kubuchwepheshe bokucubungula i-silicon carbide (SiC). Le nkampani iphumelele ekuphunyezweni kwe-12-intshi ye-silicon carbide wafers isebenzisa izixhobo zayo zokuphakamisa i-laser ezizimeleyo. Olu phuculo luphawula inyathelo elibalulekileyo eTshayina kwicandelo lezixhobo zokuvelisa izitshixo ze-semiconductor zesizukulwana sesithathu kwaye lubonelela ngesisombululo esitsha sokunciphisa iindleko kunye nokuphucula ukusebenza kakuhle kushishino lwe-silicon carbide lwehlabathi. Olu buchwepheshe lwaluqinisekiswe ngaphambili ngabathengi abaninzi kwicandelo le-6/8-intshi ye-silicon carbide, kunye nokusebenza kwezixhobo kufikelela kumanqanaba aphezulu aphesheya.

Olu phuhliso lobuchwepheshe lunentsingiselo emininzi kuphuhliso lweshishini le-silicon carbide, kuquka:

1. Ukuncipha Okubalulekileyo Kweendleko Zemveliso:Xa kuthelekiswa nee-wafers ze-silicon carbide eziqhelekileyo ze-intshi ezi-6, ii-wafers ze-silicon carbide ze-intshi ezili-12 zonyusa indawo ekhoyo malunga nezihlandlo ezine, zinciphisa iindleko ze-unit chip nge-30%-40%.

2. Amandla okubonelela ngeenkonzo kwiShishini eliPhuculweyo:Ijongana nemiqobo yobuchwephesha ekucutshungulweni kwe-silicon carbide wafer enkulu, inika inkxaso yezixhobo zokwandisa amandla emveliso ye-silicon carbide kwihlabathi liphela.

3. Inkqubo yokutshintsha indawo ngokukhawuleza:Iphula ulawulo lwetekhnoloji lweenkampani zangaphandle kwicandelo lezixhobo ezinkulu zokucubungula i-silicon carbide, inika inkxaso ebalulekileyo kuphuhliso oluzimeleyo nolulawulekayo lwezixhobo ze-semiconductor zaseTshayina.

4. Ukukhuthazwa kokuDunyiswa kweZicelo eziNgaphantsi:Ukuncitshiswa kweendleko kuya kukhawulezisa ukusetyenziswa kwezixhobo ze-silicon carbide kwiindawo eziphambili ezifana nezithuthi zamandla amatsha kunye namandla avuselelekayo.

I-Beijing Jingfei Semiconductor Technology Co., Ltd. lishishini le-Chinese Academy of Sciences Institute of Semiconductors, eligxile kuphando nophuhliso, imveliso, kunye nokuthengiswa kwezixhobo ezikhethekileyo ze-semiconductor. Ngobuchwepheshe besicelo se-laser, inkampani iphuhlise uthotho lwezixhobo zokucubungula i-semiconductor ezinamalungelo obunini bobukrelekrele azimeleyo, ekhonza abathengi abakhulu bemveliso ye-semiconductor yasekhaya.

I-CEO yeJingfei Semiconductor ithe, “Sisoloko sinamathela kubuchule bobuchwepheshe ukuze siqhubele phambili kwimizi-mveliso. Uphuhliso oluphumeleleyo lweteknoloji ye-silicon carbide laser lift-off ye-12-intshi ayibonisi nje kuphela ubuchule benkampani kodwa ikwazuza kwinkxaso enamandla yeKhomishini yeSayensi neTekhnoloji yoMasipala waseBeijing, iZiko leSayensi laseTshayina le-Semiconductors, kunye neprojekthi ekhethekileyo ephambili ethi 'Disruptive Technological Innovation' eququzelelwe kwaye yaphunyezwa yiZiko leSizwe leTekhnoloji yeBeijing-Tianjin-Hebei. Kwixesha elizayo, siya kuqhubeka nokwandisa utyalo-mali lwe-R&D ukuze sinike abathengi izisombululo zezixhobo ze-semiconductor ezikumgangatho ophezulu.”

Isiphelo

Ukujonga phambili, i-XKH iza kusebenzisa ipotifoliyo yayo epheleleyo yemveliso ye-silicon carbide substrate (egubungela ii-intshi ezi-2 ukuya kwezi-12 kunye nobuchule bokubhoboza kunye nokulungiswa okwenziwe ngokwezifiso) kunye netekhnoloji yezinto ezininzi (kubandakanya i-4H-N, i-4H-SEMI, i-4H-6H/P, i-3C-N, njl.njl.) ukujongana ngokukhutheleyo notshintsho lwetekhnoloji kwishishini le-SiC. Ngokuphucula rhoqo isivuno se-wafer, ukunciphisa iindleko zemveliso, kunye nokuqinisa intsebenziswano nabavelisi bezixhobo ze-semiconductor kunye nabathengi bokugqibela, i-XKH izibophelele ekuboneleleni ngezisombululo ze-substrate ezisebenzayo nezithembekileyo kakhulu zamandla amatsha ehlabathi, izixhobo ze-elektroniki eziphezulu, kunye nezicelo zoshishino ezishushu kakhulu. Sijonge ukunceda abathengi boyise imiqobo yobugcisa kwaye bafezekise ukusasazwa okunokukhuliswa, sizibeka njengeqabane elithembekileyo lezinto eziphambili kwikhonkco lexabiso le-SiC.