Singayinciphisa njani i-wafer ibe “ncinci kakhulu”?

Singayinciphisa njani i-wafer ibe “ncinci kakhulu”?
Yintoni kanye kanye i-wafer ebhityile kakhulu?

Uluhlu oluqhelekileyo lobukhulu (ii-wafers eziyi-8″/12″ njengemizekelo)

• I-wafer eqhelekileyo:600–775 μm

• Isonka esibhityileyo:150–200 μm

• I-wafer ebhityile kakhulu:ngaphantsi kwe-100 μm

• I-wafer ebhityileyo kakhulu:50 μm, 30 μm, okanye nokuba yi-10–20 μm

Kutheni ii-wafers zisiba ncinci?

• Nciphisa ubukhulu bephakheji iyonke, nciphisa ubude be-TSV, kwaye wehlise ukulibaziseka kwe-RC

• Yehlisa ukumelana nobushushu kwaye iphucule ukusasazwa kobushushu

• Hlangana neemfuno zemveliso yokugqibela yezinto ezibubume obuncinci kakhulu

Iingozi eziphambili zeewafers ezibhityileyo kakhulu

1. Amandla oomatshini ehla kakhulu

2. I-warpage enzima

3. Ukuphathwa nokuhanjiswa okunzima

4. Izakhiwo ezingaphambili zisengozini enkulu; ii-wafers zidla ngokuqhekeka/zaphuka

Singayinciphisa njani i-wafer ibe ncinci kakhulu?

1. I-DBG (Ukusika Ngaphambi Kokugaya)
   Sika i-wafer kancinci (ngaphandle kokuyisika yonke indlela) ukuze idayisi nganye ichazwe kwangaphambili ngelixa i-wafer ihlala iqhagamshelwe ngoomatshini ukusuka ngasemva. Emva koko susa i-wafer ukusuka ngasemva ukuze unciphise ubukhulu, ususe kancinci i-silicon eseleyo engakanqunyulwanga. Ekugqibeleni, umaleko wokugqibela we-silicon obhityileyo uyacolwa, ugqibezele ukunyibilika.

2. Inkqubo yeTaiko
   Cwilisa kuphela ummandla ophakathi we-wafer ngelixa ugcina indawo yomphetho ityebile. Umphetho otyebileyo unika inkxaso yoomatshini, unceda ekunciphiseni umngcipheko wokugoba kunye nokuphathwa.

3. Ukubopha i-wafer yexeshana
   Ukubopha okwethutyana kuncamathisela i-wafer kwi-umthwali wexeshana, iguqula i-wafer ebuthathaka kakhulu, efana nefilimu ibe yiyunithi eqinileyo nenokusetyenzwa. Isithwali sixhasa i-wafer, sikhusela izakhiwo ezingaphambili, kwaye sinciphisa uxinzelelo lobushushu—okuvumela ukunciphisaamashumi ee-micronsngelixa lisavumela iinkqubo ezirhabaxa ezifana nokwakheka kwe-TSV, ukufakelwa kwe-electroplating, kunye nokubopha. Yenye yezona teknoloji zibalulekileyo ezivumela ukupakisha kwe-3D yanamhlanje.