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Umatshini wokuSayina iDayimani ye-Multi-Wire weSiC Sapphire Ultra-Hard Brittle Materials

Umatshini wokuSarha iDayimani weZinto eziNxibeleleneyo ezininzi zeSiC Sapphire Ultra-Hard Brittle Materials Umfanekiso obonisiweyo
  • Umatshini wokuSayina iDayimani ye-Multi-Wire weSiC Sapphire Ultra-Hard Brittle Materials
  • Umatshini wokuSayina iDayimani ye-Multi-Wire weSiC Sapphire Ultra-Hard Brittle Materials
  • Umatshini wokuSayina iDayimani ye-Multi-Wire weSiC Sapphire Ultra-Hard Brittle Materials

Inkcazo emfutshane:

Umatshini wokusika idayimani oneengcingo ezininzi yinkqubo yokusika yesimanje eyenzelwe ukucubungula izinto eziqinileyo nezibuthathaka kakhulu. Ngokusebenzisa iintambo ezininzi ezigqunywe ngedayimani, umatshini unokusika ii-wafers ezininzi ngaxeshanye kumjikelo omnye, ukufezekisa zombini ukusebenza okuphezulu kunye nokuchaneka.


Iimbonakalo

Intshayelelo kuMshini wokuSawuda weDayimani oneNtambo ezininzi

Umatshini wokusarha idayimani oneengcingo ezininzi yinkqubo yokusika yesimanje eyenzelwe ukucubungula izinto eziqinileyo nezibuthathaka kakhulu. Ngokusebenzisa iingcingo ezininzi ezigqunywe ngedayimani efanayo, umatshini unokusika ii-wafers ezininzi ngaxeshanye kumjikelo omnye, ukufezekisa ukuphumelela okuphezulu kunye nokuchaneka. Le teknoloji ibe sisixhobo esibalulekileyo kumashishini afana nee-semiconductors, ii-photovoltaics zelanga, ii-LEDs, kunye neeseramikhi eziphambili, ngakumbi kwizixhobo ezifana neSiC, i-sapphire, i-GaN, i-quartz, kunye ne-alumina.

Xa kuthelekiswa nokusika kwentambo enye eqhelekileyo, ulungiselelo lweentambo ezininzi luzisa amashumi ukuya kumakhulu ezilayi ngebhetshi nganye, kunciphisa kakhulu ixesha lokujikeleza ngelixa kugcinwa ukuthamba okugqwesileyo (Ra < 0.5 μm) kunye nokuchaneka kobukhulu (± 0.02 mm). Uyilo lwayo lwemodyuli ludibanisa ukuxinwa kweentambo okuzenzakalelayo, iinkqubo zokuphatha izinto zomsebenzi, kunye nokubeka esweni kwi-intanethi, ukuqinisekisa imveliso yexesha elide, ezinzileyo, nezenzekelayo ngokupheleleyo.

Iiparameter zobugcisa zoMatshini wokuSawuda weDayimani onezintambo ezininzi

Into Inkcazo Into Inkcazo
Ubungakanani bomsebenzi obukhulu (Isikwere) 220 × 200 × 350 mm Imoto yokuqhuba 17.8 kW × 2
Ubungakanani bomsebenzi obukhulu (Umjikelo) Φ205 × 350 mm Imoto yokuqhuba ngocingo 11.86 kW × 2
Isithuba se-spindle Φ250 ±10 × 370 × 2 i-axis (mm) Injini yokuphakamisa itafile yokusebenza 2.42 kW × 1
I-axis eyintloko 650 mm Injini yokujika 0.8 kW × 1
Isantya sokusebenza kwentambo 1500 m/ngomzuzu Imoto yolungiselelo 0.45 kW × 2
Ububanzi bentambo Φ0.12–0.25 mm Injini yoxinzelelo 4.15 kW × 2
Isantya sokuphakamisa 225 mm/ngomzuzu Injini yodaka 7.5 kW × 1
Ujikelezo oluphezulu lwetafile ±12° Umthamo wetanki yodaka 300 L
I-engile yokujika ±3° Ukuhamba kwesipholisi 200 L/ngomzuzu
Isantya sokujika ~Amaxesha angama-30/ngomzuzu Ukuchaneka kobushushu ±2 °C
Izinga lokutya 0.01–9.99 mm/ngomzuzu Ukunikezwa Amandla 335+210 (mm²)
Isantya sokutya ngentambo 0.01–300 mm/ngomzuzu Umoya ocinezelweyo 0.4–0.6 MPa
Ubungakanani bomatshini 3550 × 2200 × 3000 mm Ubunzima 13,500 kg

Indlela yokusebenza yoMatshini wokuSarha iDayimani onezintambo ezininzi

  1. Intshukumo Yokusika Ngeentambo Ezininzi
    Iintambo zedayimani ezininzi zihamba ngesantya esihambelanayo ukuya kuthi ga kwi-1500 m/min. Iipulleys ezikhokelwa ngokuchanekileyo kunye nolawulo loxinzelelo oluvaliweyo (15–130 N) zigcina iingcingo zizinzile, zinciphisa amathuba okuphambuka okanye ukwaphuka.

  2. Ukondla kunye nokubeka indawo ngokuchanekileyo
    Indawo eqhutywa yiServo ifikelela kwi-±0.005 mm yokuchaneka. Ukulungelelaniswa nge-laser okanye ngoncedo lombono kuphucula iziphumo zeemilo ezintsonkothileyo.

  3. Ukupholisa kunye nokususa inkunkuma
    Isicoci soxinzelelo oluphezulu sisusa rhoqo iitships kwaye sipholise indawo yokusebenza, sithintela umonakalo wobushushu. Ukucoca ngamanqanaba amaninzi kwandisa ubomi besicoci kwaye kunciphisa ixesha lokungasebenzi.

  4. Iqonga loLawulo oluHlakaniphileyo
    Abaqhubi be-servo abaphendula kakhulu (<1 ms) balungisa ngokuguquguqukayo i-feed, uxinzelelo, kunye nesantya seentambo. Ulawulo oludibeneyo lweresiphi kunye nokutshintsha kweparameter ngokucofa kanye kwenza kube lula ukuvelisa ubunzima.

Iingenelo Eziphambili Zomatshini Wokusika Idayimani Osebenzisa Iintambo Ezininzi

  • Imveliso Ephezulu
    Iyakwazi ukusika ii-wafer ezingama-50–200 ngexesha ngalinye, kunye nokulahleka kwe-kerf <100 μm, ukuphucula ukusetyenziswa kwezinto ukuya kuthi ga kwi-40%. Ubungakanani bokusetyenziswa buyi-5–10× yobukhulu beenkqubo zendabuko zentambo enye.

  • Ulawulo Oluchanekileyo
    Uzinzo loxinzelelo lwentambo ngaphakathi kwe-±0.5 N luqinisekisa iziphumo ezihambelanayo kwizixhobo ezahlukeneyo ezibuthathaka. Ukubeka iliso ngexesha langempela kwi-interface ye-HMI ye-10" kuxhasa ukugcinwa kweresiphi kunye nokusebenza kude.

  • Ulwakhiwo oluguquguqukayo, oluyiModular
    Iyahambelana nobubanzi bentambo ukusuka kwi-0.12–0.45 mm kwiinkqubo ezahlukeneyo zokusika. Ukuphathwa kwerobhothi okukhethwayo kuvumela imigca yemveliso ezenzekelayo ngokupheleleyo.

  • Ukuthembeka kweMigangatho yezeMveliso
    Iifreyimu eziqinileyo/ezibunjiweyo zinciphisa ukuguquguquka (<0.01 mm). Iipulleys ezikhokelayo ezineengubo zeseramikhi okanye zekhabhayithi zibonelela ngobomi benkonzo obungaphezulu kweeyure ezingama-8000.

Inkqubo yokuSayina iDayimani enezintambo ezininzi yeSiC Sapphire Ultra-Hard Brittle Materials 2

IiNdawo zoSetyenziso loMatshini wokuSawuda weDayimani oneNtambo ezininzi

  • Ii-semiconductors: Ukusika i-SiC kwiimodyuli zamandla e-EV, ii-substrates ze-GaN kwizixhobo ze-5G.

  • Iifotovoltaics: Isilayi se-silicon wafer esikhawulezayo esinokulingana kwe-±10 μm.

  • I-LED kunye ne-Optics: Ii-substrates ze-sapphire zezinto ze-epitaxy kunye ne-precision optical ezine-edge chipping edge edge engaphantsi kwama-20 μm.

  • Iiceramics eziPhambili: Ukucutshungulwa kwe-alumina, i-AlN, kunye nezinye izinto ezifanayo zezixhobo zolawulo lweenqwelo-moya kunye nobushushu.

Inkqubo yokuSayina iDayimani enezintambo ezininzi yeSiC Sapphire Ultra-Hard Brittle Materials 3

 

Inkqubo yokuSayina iDayimani enezintambo ezininzi yeSiC Sapphire Ultra-Hard Brittle Materials 5

Inkqubo yokuSayina iDayimani enezintambo ezininzi yeSiC Sapphire Ultra-Hard Brittle Materials 6

Imibuzo Ebuzwa Rhoqo – Umatshini Wokusika Idayimani Osebenzisa Iintambo Ezininzi

Umbuzo 1: Ziziphi iingenelo zokusarha ngeengcingo ezininzi xa kuthelekiswa noomatshini beengcingo enye?
A: Iinkqubo zeengcingo ezininzi zinokusika amashumi amaninzi ukuya kumakhulu ee-wafers ngaxeshanye, nto leyo enyusa ukusebenza kakuhle nge-5–10×. Ukusetyenziswa kwezinto kuphezulu kakhulu xa i-kerf ilahlekile ngaphantsi kwe-100 μm, nto leyo eyenza ukuba ilungele imveliso enkulu.

Q2: Zeziphi iintlobo zezinto ezinokucutshungulwa?
A: Lo matshini wenzelwe izinto eziqinileyo nezibuthathaka, kuquka i-silicon carbide (SiC), i-sapphire, i-gallium nitride (GaN), i-quartz, i-alumina (Al₂O₃), kunye ne-aluminium nitride (AlN).

Q3: Ithini indlela yokuchaneka enokufikelelwa kunye nomgangatho womphezulu?
A: Uburhabaxa bomphezulu bunokufikelela kwiRa <0.5 μm, ngokuchaneka kobukhulu be-±0.02 mm. Ukuqhekeka komphetho kunokulawulwa ukuya kuthi ga kwi-<20 μm, ukuhlangabezana nemigangatho yoshishino lwe-semiconductor kunye ne-optoelectronic.

Umbuzo 4: Ngaba inkqubo yokusika ibangela iintanda okanye umonakalo?
A: Ngokusetyenziswa kwe-coolant enoxinzelelo oluphezulu kunye nolawulo loxinzelelo oluvaliweyo, umngcipheko wee-micro-cracks kunye nomonakalo woxinzelelo uyancitshiswa, okuqinisekisa ukuthembeka kwe-wafer okuhle kakhulu.

  • Ngaphambili:
  • Okulandelayo:

    • Iimveliso eziNxulumeneyo

    Bhala umyalezo wakho apha uze uwuthumele kuthi
    Cofa u-enter ukuze uphendle okanye ucofe u-ESC ukuze uvale