Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Weentambo Ezininzi Ophezulu Ophezulu Ochanekileyo Ophezulu
Umzobo oneenkcukacha
Yazisa
Umatshini wokusika i-drown swing osebenzisa i-diamond wire multi-wire high-speed high-precision high-precision sisixhobo se-CNC esiphucukileyo esenzelwe ukucutshungulwa ngokuchanekileyo kwezinto eziqinileyo nezibuthathaka. Udibanisa ubuchwepheshe obuphambili, kubandakanya ukuqhuba i-wire ngesantya esiphezulu, ulawulo lwentshukumo oluchanekileyo kakhulu, ukusika i-multi-wire ngaxeshanye, kunye nokusika i-downward swing. Lo matshini ufezekisa ukucutshungulwa okukhulu kwe-workpiece ngokusebenza kakuhle kakhulu kunye nomgangatho womphezulu.
Ngokusebenzisa ucingo lwedayimani njengendlela yokusika, umatshini ubonelela ngokumelana nokuguguleka okuphezulu kunye nokuchaneka kokusika xa kuthelekiswa neendlela zokusika zendabuko. Uyilo lwawo lweengcingo ezininzi luvumela ukunqunyulwa kweebhetshi zezinto zokusebenza ezininzi ngaxeshanye, luphucula kakhulu imveliso ngelixa lunciphisa iindleko zokuvelisa. Intshukumo yokujika ezantsi isasaza amandla okusika ngokulinganayo, inciphisa iziphene zomphezulu kunye nokuqhekeka okuncinci, okubangela ukuba iindawo zokusika zibe bushelelezi kwaye zicoceke.
Iingenelo zobugcisa
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Ukusika Ngesantya Esiphezulu: Isantya sokusebenza kweentambo ukuya kuthi ga kwi-2000 m/min, nto leyo enciphisa kakhulu ixesha lokucubungula.
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Ubuchule obuphezulu: Ukuchaneka kokusika ukuya kuthi ga kwi-0.01 mm, ukuqinisekisa ukuqina okugqwesileyo kunye nesantya sokuvunwa.
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Ubuchule bokusebenzisa iintambo ezininzi: Umthamo wokugcina iingcingo ezingama-20 km, uxhasa ukusika okukhulu okuhamba ngaxeshanye.
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Ukusika ngeSwing: ±8° umgama wokujika kwi-0.83°/s usasaza ngokulinganayo uxinzelelo, wandisa ubomi bentambo kwaye uphucula umgangatho womphezulu.
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Ulawulo lweNgxaki oluGuquguqukayo: Uxinzelelo lokusika oluhlengahlengiswayo ukusuka kwi-10N ukuya kwi-60N (ukunyuka kwe-0.1N), oluhlengahlengiswayo kwizixhobo ezahlukeneyo.
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Ulwakhiwo Oluqinileyo: Ubunzima bomatshini obuyi-8000 kg buqinisekisa ukuqina okuphezulu kunye nokusebenza okuzinzileyo ngexesha lokusebenza ixesha elide.
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Inkqubo yoLawulo oluQondileyo: Ujongano olusebenziseka lula oluneseto lweparameter, ukujonga ngexesha langempela, kunye nemisebenzi ye-alamu yempazamo.
Izicelo eziqhelekileyo
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Ishishini le-Photovoltaic
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Ukusikwa kwee-ingots ze-silicon ze-monocrystalline kunye ne-polycrystalline
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Ukuveliswa kwee-solar wafers ezisebenza kakuhle kakhulu
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Iphucula ukusetyenziswa kwezinto kwaye inciphisa iindleko zokucubungula
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Ishishini leSemiconductor
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Ukusikwa ngokuchanekileyo kweSiC, GaAs, Ge, kunye nezinye ii-wafers ze-semiconductor
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Ukusika i-wafer enobubanzi obukhulu ukuze kwenziwe iitships
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Iqinisekisa umgangatho ophezulu womphezulu kwiinkqubo ze-semiconductor ezifuna kakhulu
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Ukucubungula Izinto Ezintsha
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Ukusikwa kwesafire substrate yezixhobo ze-LED kunye nezokukhanya
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Ukusikwa ngokuchanekileyo kweekristale zokwenziwa kunye nezinto zemagnethi
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Ukucutshungulwa kwe-quartz, iiseramikhi zeglasi, kunye nezinye izinto eziqinileyo
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Ukusetyenziswa koPhando kunye neLebhu
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Ukulungiselela isampuli yophando olutsha lwezinto ezibonakalayo
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Uvavanyo lokusika oluchanekileyo kakhulu oluncinci
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Ukuqinisekiswa kwenkqubo ethembekileyo kwizicelo ze-R&D
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Iinkcukacha zobugcisa
| Ipharamitha | Inkcazo |
| Iprojekthi | Isarha yentambo enemigca emininzi enebhentshi yokusebenza phezulu |
| Ubungakanani obukhulu bomsebenzi | ø 204*500mm |
| Ububanzi be-roller coating obuphambili (Buzinzile kuzo zombini iziphelo) | ø 240*510mm (iirola ezimbini eziphambili) |
| Isantya sokusebenza kwentambo | 2000 (XIX) m/min |
| Ububanzi bentambo yedayimani | 0.1-0.5mm |
| Umthamo wokugcina umgca wevili lokuhambisa | 20 (0.25 ububanzi bentambo yedayimani) km |
| Uluhlu lokusika ubukhulu | 0.1-1.0mm |
| Ukuchaneka kokusika | 0.01mm |
| Ukunyuka okuthe nkqo kwendawo yokusebenza | 250mm |
| Indlela yokusika | Izinto ziyashukuma kwaye zehle ukusuka phezulu ukuya ezantsi, ngelixa indawo yomgca wedayimani ingatshintshanga |
| Isantya sokusika ukutya | 0.01-10mm/ngomzuzu |
| Itanki yamanzi | 300L |
| Ulwelo lokusika | Ulwelo lokusika olusebenza kakuhle kakhulu oluchasene nomhlwa |
| Isantya sokujika | 0.83°/s |
| Uxinzelelo lwepompo yomoya | 0.3-3MPa |
| I-engile yokujika | ±8° |
| Uxinzelelo olukhulu lokusika | 10N-60N (Iyunithi encinci isetiwe yi-0.1N) |
| Ubunzulu bokusika | 500mm |
| Indawo yokusebenzela | 1 |
| Ukunikezwa Amandla | I-AC380V/50Hz enamacingo amahlanu enamanqanaba amathathu |
| Amandla apheleleyo esixhobo somatshini | ≤92kW |
| Injini ephambili (Ukupholisa ukujikeleza kwamanzi) | 22*2kW |
| Injini yocingo | 1*2kW |
| Injini yokujika yebhentshi yokusebenza | 1.3*1kW |
| Injini yokulawula uxinzelelo (Ukupholisa ukujikeleza kwamanzi) | 5.5*2kW |
| Imoto yokukhupha iingcingo kunye nokuqokelela | 15*2kW |
| Ubukhulu bangaphandle (ngaphandle kwebhokisi yengalo yerocker) | 1320*2644*2840mm |
| Ubukhulu bangaphandle (kubandakanya ibhokisi yengalo yerocker) | 1780*2879*2840mm |
| Ubunzima bomatshini | 8000kg |
FAQ
1. Q: Yintoni inzuzo yokusika ngokujikajika kwiisarha zentambo yedayimani?
A: Ukusika okujijekileyo (±8°) kunciphisa ukuqhekeka ukuya kwi-<15μm kwaye kuphucula ukugqitywa komphezulu (Ra<0.5μm) kwizinto ezibuthathaka ezifana neSiC kunye nesafire.
2. Q: Iisarha zedayimani ezineentambo ezininzi zingasika ngokukhawuleza kangakanani ii-wafer ze-silicon?
A: Ngeentambo ezingaphezu kwama-200 kwi-1-3m/s, inqumla ii-wafers ze-silicon ezingama-300mm ngemizuzu engaphantsi kwemi-2, inyusa imveliso ngokuphindwe kahlanu xa kuthelekiswa neesarha ezinentambo enye.
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