Umatshini wokusika iDayimane yocingo lweSiC | Isafire | Iquartz | Iglasi

Umatshini wokusika iDayimane yocingo lweSiC | Isafire | Iquartz | Umfanekiso obonakalisiweyo weglasi

Inkcazelo emfutshane:

I-Diamond Wire Single-Line Cutting System sisisombululo esiphezulu senkqubo esenzelwe ukusika i-ultra-hard and brittle substrates. Ukusebenzisa ucingo olufakwe ngedayimani njengendlela yokusika, izixhobo zihambisa isantya esiphezulu, umonakalo omncinci, kunye nokusebenza ngokufanelekileyo. Ilungele usetyenziso olunje ngesafire wafers, iiboules zeSiC, iipleyiti zequartz, iiseramikhi, iglasi yokukhanya, iintonga zesilicon, kunye namatye anqabileyo.

Thumela i-imeyile kuthi

Iimbonakalo

Idayagram eneenkcukacha yoMshini wokusika i-Diamond Wire

Amagqabantshintshi ngoMatshini wokusika ucingo lweDayimane

Xa kuthelekiswa neencakuba zesarha zemveli okanye iingcingo ezirhabaxa, obu buchwephesha bubonelela ngokuchaneka okuphezulu komgangatho, ilahleko esezantsi yekerf, kunye nokuphuculwa komgangatho wentembeko. Isetyenziswa ngokubanzi kuzo zonke i-semiconductors, i-photovoltaics, izixhobo ze-LED, i-optics, kunye nokulungiswa kwamatye okuchanekileyo, kwaye ayixhasi nje ukusika umgca othe tye kodwa kunye nokusika okukhethekileyo kwezinto ezinobukhulu obungaphezulu okanye obungaqhelekanga.

diamond_wire_single_line_cutting_machine_for_sic_sapphire_quartz_ceramic_material

Umgaqo wokuSebenza

Umatshini usebenza ngokuqhuba aucingo lwedayimani kwisantya esiphezulu somgca (ukuya kuthi ga kwi-1500 m/min). Iinqununu ezixubileyo ezifakwe kwi-wire zisusa izinto ngokusebenzisa i-micro-grinding, ngelixa iinkqubo ezincedisayo ziqinisekisa ukuthembeka kunye nokuchaneka:

Ukutya okuchanekileyo:I-Servo-driven motion with linear guide rails ifezekisa ukusika okuzinzileyo kunye nokubeka i-micron-level level.
Ukupholisa nokuCoca:Ukugungxulwa ngokuqhubekayo kwamanzi kunciphisa impembelelo ye-thermal, kuthintela i-micro-cracks, kwaye isuse i-debris ngokufanelekileyo.
Ulawulo lweTension yocingo:Ukulungelelaniswa ngokuzenzekelayo kugcina amandla rhoqo kwi-wire (± 0.5 N), ukunciphisa ukuphambuka kunye nokuphuka.
Iimodyuli ozikhethayo:Izigaba ezijikelezayo ze-angled okanye i-cylindrical workpieces, iisistim eziphezulu zoxinzelelo lwezixhobo ezilukhuni, kunye nokulungelelaniswa okubonakalayo kwiijometri ezinzima.

IiNgcaciso zobuGcisa

Into	Ipharamitha	Into	Ipharamitha
Ubungakanani bomsebenzi omkhulu	600×500 mm	Isantya sokubaleka	1500 m/min
I-engile ejingi	0 ~ ± 12.5 °	Ukukhawulezisa	5 m/s²
Swing Frequency	6~30	Ukusika isantya	<3 iiyure (6-intshi SiC)
Lift Stroke	650 mm	Ukuchaneka	<3 μm (6-intshi yeSiC)
Sliding Stroke	≤500 mm	Idayamitha yocingo	φ0.12~φ0.45 mm
Phakamisa isantya	0~9.99 mm/min	Ukutya umbane	44.4 kW
Rapid Travel Speed	200 mm/min	Ubungakanani bomatshini	2680×1500×2150 mm
Tension rhoqo	15.0N~130.0N	Ubunzima	3600 kg
Ukuchaneka koxinzelelo	±0.5 N	Ingxolo	≤75 dB(A)
Umgama osembindini wamavili esiKhokelo	680~825 mm	Ubonelelo ngerhasi	>0.5 MPa
ITanki yokupholisa	30 L	Intambo yoMbane	4×16+1×10 mm²
Imoto yodaka	0.2 kW	-	-

Izinto Eziluncedo Ezingundoqo

Ukusebenza okuphezulu kunye neKerf eNcitshisiweyo

Izantya zocingo ukuya kuthi ga kwi-1500 m/min ukuze kugqitywe ngokukhawuleza.

Ububanzi be-kerf emxinwa buthoba ilahleko yemathiriyeli ukuya kuthi ga kwi-30%, ikhulisa isivuno.

Iyaguquguquka kwaye isebenziseka lula

Isikrini esichukumisayo se-HMI enokugcinwa kweresiphi.

Ixhasa ngokuthe tye, igophe, kunye ne-multi-slice synchronous operations.

Imisebenzi Eyandiswayo

Isigaba esijikelezayo se-bevel kunye ne-circular cuts.

Iimodyuli eziphezulu zoxinzelelo lwe-SiC ezinzileyo kunye nokusika kwesafire.

Izixhobo zokulungelelaniswa kwe-Optical kumacandelo angekho mgangathweni.

Uyilo lweMechanical oluzinzileyo

Isakhelo esinzima esinzima sichasa ukungcangcazela kwaye siqinisekisa ukuchaneka kwexesha elide.

Izinto eziphambili zokunxiba zisebenzisa i-ceramic okanye i-tungsten carbide coatings kwi>5000 iiyure zenkonzo yobomi.

Umatshini wokusika iDayimane yocingo lweSiC Sapphire Quartz Glass 3

Amashishini ezicelo

IiSemiconductors:Ukusikwa kwe-ingot ye-SiC esebenzayo kunye nelahleko ye-kerf <100 μm.

I-LED & Optics:Ukulungiswa kwe-wafer yesafire echanekileyo ephezulu yeefotonics kunye ne-elektroniki.

Ishishini leSolar:Ukusika intonga ye-silicon kunye nokusikwa kweeseli ze-PV.

Umbono kunye nobucwebe:Ukusika kakuhle i-quartz kunye namatye anqabileyo kunye noRa <0.5 μm ukugqiba.

IAerospace & Ceramics:Ukucutshungulwa kwe-AlN, i-zirconia, kunye neekeramics eziphuculweyo zokusetyenziswa kobushushu obuphezulu.

Umatshini wokusika iDayimane yocingo lweSiC Sapphire Quartz Glass 4

FAQ yeeglasi zeQuartz

I-Q1: Ziziphi izinto ezinokusikwa ngumatshini?
A1:Ilungiselelwe iSiC, isafire, iquartz, isilicon, iiseramikhi, iglasi yokukhanya, kunye namatye anqabileyo.

I-Q2: Ichaneke kangakanani inkqubo yokusika?
A2:Kwii-intshi ezi-6 ze-SiC, ukuchaneka kobukhulu kunokufikelela <3 μm, kunye nomgangatho obalaseleyo womphezulu.

I-Q3: Kutheni i-diamond wire cuting iphezulu kuneendlela zendabuko?
A3:Inika isantya esikhawulezayo, ilahleko ye-kerf encitshisiweyo, umonakalo omncinci wobushushu, kunye nemiphetho egudileyo xa kuthelekiswa neengcingo ezirhabaxa okanye ukusika i-laser.

I-Q4: Ngaba iyakwazi ukucubungula imilo ye-cylindrical okanye engaqhelekanga?
A4:Ewe. Ngenqanaba lokujikeleza elikhethiweyo, linokwenza i-circular, bevel, kunye ne-angled slicing kwiintonga okanye iiprofayili ezikhethekileyo.

I-Q5: Ilawulwa njani intambo yocingo?
A5:Inkqubo isebenzisa uhlengahlengiso oluzenzekelayo lwe-loop-loop tension kunye ne-± 0.5 N ukuchaneka ukukhusela ukuphuka kwentambo kunye nokuqinisekisa ukusika okuzinzile.

Q6: Ngawaphi amashishini asebenzisa obu buchwepheshe kakhulu?
A6:Ukwenziwa kweSemiconductor, amandla elanga, i-LED & photonics, imveliso yecandelo lokukhanya, ubucwebe, kunye neeseramikhi ze-aerospace.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo yeglasi kunye nezinto ezintsha zekristale. Iimveliso zethu zisebenza ngombane obonakalayo, i-elektroniki yabathengi, kunye nomkhosi. Sinikezela ngezixhobo zeSapphire optical, iilensi zeselfowuni eziphathwayo, iiCeramics, LT, Silicon Carbide SIC, Quartz, kunye nesemiconductor crystal wafers. Ngobuchule bezakhono kunye nezixhobo ezibukhali, sigqwesa ekusetyenzweni kwemveliso engeyiyo eyomgangatho, sijonge ukuba lishishini eliphambili le-optoelectronic tech-tech.