Umatshini wokusika iDayimane ngentambo yeSiC | I-Sapphire | I-Quartz | Iglasi

Umatshini wokusika iingcingo zedayimani zeSiC | I-Sapphire | I-Quartz | Umfanekiso oGlasi oPhambili

Inkcazo emfutshane:

Inkqubo yokusika iDiamond Wire Single-Line Cutting System sisisombululo esiphucukileyo esenzelwe ukusika izinto eziqinileyo neziqhekekileyo. Sisebenzisa ucingo olugqunywe yidayimani njengendlela yokusika, esi sixhobo sinikezela ngesantya esiphezulu, umonakalo omncinci, kunye nokusebenza okungabizi kakhulu. Silungele ukusetyenziswa njengee-wafers zesafire, ii-SiC boules, iipleyiti ze-quartz, iiseramikhi, iglasi ye-optical, iintonga ze-silicon, kunye namatye anqabileyo.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha zoMshini wokusika iDayimane ngeNtambo

Isishwankathelo soMatshini wokusika iDayimane

Xa kuthelekiswa neebhlawu zesarha zemveli okanye iingcingo ezirhabaxa, obu buchwephesha bubonelela ngokuchaneka okuphezulu, ukulahleka kwe-kerf ephantsi, kunye nokuphuculwa komgangatho womphezulu. Busetyenziswa kakhulu kwii-semiconductors, ii-photovoltaics, izixhobo ze-LED, ii-optics, kunye nokucutshungulwa kwamatye ngokuchanekileyo, kwaye abuxhasi kuphela ukusika okuthe tye kodwa kunye nokusika okukhethekileyo kwezinto ezinkulu okanye ezimile ngendlela engaqhelekanga.

umatshini_wokusika_umgca_omnye_wedayimani_wesafire_quartz_wezinto_zeseramikhi

Umgaqo-nkqubo Wokusebenza

Umatshini usebenza ngokuqhubaucingo lwedayimani kwisantya esiphezulu kakhulu (ukuya kuthi ga kwi-1500 m/min)Amasuntswana arhabaxa afakwe kwintambo asusa izinto ngokusebenzisa i-micro-grinding, ngelixa iinkqubo ezincedisayo ziqinisekisa ukuthembeka nokuchaneka:

Ukondla ngokuchanekileyo:Intshukumo eqhutywa yiServo enezikhonkwane ezikhokelayo ezithe tye ifikelela ekusikeni okuzinzileyo kunye nokubekwa kwinqanaba le-micron.
Ukupholisa kunye nokucoca:Ukucoca ngamanzi rhoqo kunciphisa impembelelo yobushushu, kuthintela ukuqhekeka okuncinci, kwaye kususa inkunkuma ngokufanelekileyo.
Ulawulo loxinzelelo lwentambo:Uhlengahlengiso oluzenzekelayo lugcina amandla angaguqukiyo kwintambo (± 0.5 N), lunciphisa ukuphambuka kunye nokuqhekeka.
Iimodyuli eziKhethekileyo:Amanqanaba okujika kwezinto zokusebenza ezineekona okanye ezisilinda, iinkqubo zoxinzelelo oluphezulu lwezinto eziqinileyo, kunye nokulungelelaniswa okubonakalayo kwejometri ezintsonkothileyo.

Iinkcukacha zobugcisa

Into	Ipharamitha	Into	Ipharamitha
Ubungakanani boMsebenzi obuphezulu	600×500 mm	Isantya sokubaleka	1500 m/ngomzuzu
I-Angle ye-Swing	0~±12.5°	Ukukhawulezisa	5 m/s²
Ukuphindaphinda kweSwing	6~30	Isantya sokusika	<3 iiyure (6-intshi SiC)
I-Lift Stroke	650 mm	Ukuchaneka	<3 μm (6-intshi SiC)
Istroke esityibilikayo	≤500 mm	Ububanzi bentambo	φ0.12~φ0.45 mm
Isantya sokuphakamisa	0~9.99 mm/ngomzuzu	Ukutya umbane	44.4 kW
Isantya Sokuhamba Esikhawulezayo	200 mm/ngomzuzu	Ubungakanani bomatshini	2680×1500×2150 mm
Uxinzelelo oluqhubekayo	15.0N~130.0N	Ubunzima	3600 kg
Ukuchaneka koxinzelelo	±0.5 N	Ingxolo	≤75 dB(A)
Umgama ophakathi wamavili esikhokelo	680~825 mm	Ubonelelo ngeGesi	>0.5 MPa
Itanki yeSipholisi	30 L	Umgca woMbane	4×16+1×10 mm²
Imoto yeMortar	0.2 kW	—	—

Iingenelo eziphambili

Ukusebenza kakuhle okuphezulu kunye neKerf encitshisiweyo

Isantya sentambo ukuya kuthi ga kwi-1500 m/min ukuze ikwazi ukusebenza ngokukhawuleza.

Ububanzi obuncinci be-kerf bunciphisa ukulahleka kwezinto ukuya kuthi ga kwi-30%, nto leyo eyenza ukuba isivuno sibe sikhulu.

Iguquguqukayo kwaye ilula ukuyisebenzisa

I-HMI yesikrini sokuchukumisa eneendawo zokugcina iiresiphi.

Ixhasa imisebenzi ethe tye, egobileyo, kunye ne-multi-slice synchronous.

Imisebenzi Enokwandiswa

Inqanaba lokujikeleza lokusika i-bevel kunye ne-circular.

Iimodyuli zoxinzelelo oluphezulu zokusika i-SiC ezinzileyo kunye ne-sapphire.

Izixhobo zokulungelelanisa ezibonakalayo kwiindawo ezingezizo ezisemgangathweni.

Uyilo lweMishini oluhlala ixesha elide

Isakhelo esinzima somdibaniso simelana nokungcangcazela kwaye siqinisekisa ukuchaneka kwexesha elide.

Izinto ezisetyenziswa kakhulu xa kunxitywa zisebenzisa i-ceramic okanye i-tungsten carbide coatings kangangeeyure ezingaphezu kwama-5000.

Umatshini wokusika iDayimane yeSiC Sapphire Quartz Glass 3

Imizi-mveliso yezicelo

IiSemiconductors:Ukusikwa kwe-SiC ingot okusebenzayo kunye nokulahleka kwe-kerf <100 μm.

I-LED kunye ne-Optics:Ukulungiswa kwe-wafer yesafire echanekileyo kakhulu kwi-photonics nakwi-elektroniki.

Ishishini leLanga:Ukusikwa kwentonga yesilicon kunye nokusikwa kwewafer kwiiseli zePV.

Izinto ezibonakalayo kunye nobucwebe:Ukusikwa kakuhle kwe-quartz kunye namatye anqabileyo ane-Ra <0.5 μm finish.

Iinqwelo-moya kunye neeseramikhi:Ukucubungula i-AlN, i-zirconia, kunye neeseramikhi eziphambili ukuze zisetyenziswe kubushushu obuphezulu.

Umatshini wokusika iDayimane yeSiC Sapphire Quartz Glass 4

Imibuzo ebuzwa rhoqo ngeeGlasi zeQuartz

Q1: Zeziphi izinto ezinokuthi zisikwe ngumatshini?
A1:Yenzelwe iSiC, isafire, iquartz, isilicon, iiseramikhi, iglasi ebonakalayo, kunye namatye anqabileyo.

Umbuzo 2: Ichaneke kangakanani inkqubo yokusika?
A2:Kwii-wafers ze-SiC eziyi-6-intshi, ukuchaneka kobukhulu kunokufikelela kwi-<3 μm, ngomgangatho ogqwesileyo womphezulu.

Umbuzo 3: Kutheni ukusika ucingo lwedayimani kungcono kuneendlela zemveli?
A3:Inika isantya esikhawulezayo, ilahleko ephantsi ye-kerf, umonakalo omncinci wobushushu, kunye nemiphetho egudileyo xa ithelekiswa neengcingo ezirhabaxa okanye ukusika nge-laser.

Umbuzo 4: Ngaba ingakwazi ukucubungula iimilo ezisilinda okanye ezingaqhelekanga?
A4:Ewe. Ngesigaba esijikelezayo esinganyanzelekanga, ingenza ukusika okujikelezayo, okune-bevel, kunye nokugoba kwiintonga okanye kwiiprofayili ezikhethekileyo.

Umbuzo 5: Ilawulwa njani i-wire tension?
A5:Le nkqubo isebenzisa uhlengahlengiso oluzenzekelayo loxinzelelo oluvaliweyo oluchanekileyo olune-±0.5 N ukuthintela ukwaphuka kwentambo nokuqinisekisa ukusika okuzinzileyo.

Umbuzo 6: Ngawaphi amashishini asebenzisa obu buchwepheshe kakhulu?
A6:Ukwenziwa kwee-semiconductors, amandla elanga, ii-LED kunye nee-photonics, ukwenziwa kwezinto ezibonakalayo, ubucwebe, kunye neeseramikhi zeenqwelo-moya.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.