Izixhobo zoLawulo loBushushu oluDiamond-Copper Composite

Izinto zoLawulo loBushushu oluDibanisiweyo lweDayimane-uCopper Umfanekiso obonisiweyo

Inkcazo emfutshane:

I-Diamond-Copper Composite (iCu-Diamond) sisixhobo sokulawula ubushushu esisebenza kakuhle kakhulu esidibanisa eyona ntambo yobushushu ibalaseleyo kwihlabathi — idayimani — kunye neempawu zombane nezoomatshini ezigqwesileyo zekopolo.
Yenzelwe izixhobo ze-elektroniki kunye namandla ezisemgangathweni, le nhlanganisela ifezekisa ibhalansi eyahlukileyo yokuqhuba ubushushu obugqithisileyo, ukwanda kobushushu obulawulekayo, kunye nozinzo loomatshini, okuvumela ukusebenza okuthembekileyo naphantsi kweemeko zobushushu ezifuna kakhulu.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha

Intshayelelo yeMveliso

II-Diamond-Copper Composite (iCu-Diamond)yiizixhobo zolawulo lobushushu olusebenza kakhuluedibanisa umqhubi wobushushu obalaseleyo kwihlabathi —idayimani— eneempawu zombane nezoomatshini eziphezuluithusi.
Yenzelwe izixhobo ze-elektroniki kunye nezixhobo zamandla ezisemgangathweni ophezulu, le nhlanganisela ifumana ibhalansi eyahlukileyoukuqhuba okugqithisileyo kobushushu, ukwanda kobushushu okulawulwayokunyeuzinzo loomatshini, okuvumela ukusebenza okuthembekileyo naphantsi kweemeko ezishushu kakhulu.

Ngokungafaniyo ne-substrates ze-copper, tungsten, okanye i-molybdenum zesiqhelo, ii-Diamond-Copper composites zibonelelaukuya kuthi ga kabini kune-thermal conductivityngelixa benciphisa ubunzima kakhulu, nto leyo ebenza babe lukhetho olukhethwayoukupakishwa kwe-semiconductor, iinkqubo ze-laser, izixhobo ze-elektroniki ze-aerospace, kunye neemodyuli ze-LED ezinamandla aphezulu.

Umgaqo wezinto eziphathekayo

Eyona nto iphambili kwezi zinto zidibeneyoamasuntswana edayimaniihlanganiswe ngokulinganayo ngaphakathiimatrix yobhedu.
Isuntswana ngalinye ledayimani lisebenza njengesinki sobushushu esincinci, lisasaza ubushushu ngokukhawuleza, ngelixa i-matrix yobhedu iqinisekisa ukuqhutywa kombane kunye nokuqina kwesakhiwo.
Ngeendlela zokuvelisa eziphambili — kuqukaukungena kwe-vacuum, ugqubuthelo lweekhemikhalikunyei-spark plasma sintering (SPS)— kwakheka i-interface bond eqinileyo nezinzileyo, eqinisekisa ukuthembeka kwexesha elide phantsi komjikelo wobushushu oqhubekayo.

Iimbalasane zobugcisa

Ipropati	Ixabiso / Inkcazo
Ukuqhuba kweThermal	400 – 700 W/m·K
I-Coefficient of Thermal Expansion (CTE)	5 – 8 × 10⁻⁶/K
Uxinano	6.0 – 7.0 g/cm³
Ukugqitywa komphezulu	I-Ni/Au plating iyafumaneka ukuze itshiswe okanye igqunywe ngebrazing
Ukwenziwa ngokwezifiso	Umxholo wedayimani kunye ne-CTE zinokulungiswa ngokweemfuno zabathengi

Izicelo

Iimodyuli zeSemiconductor ezinamandla aphezulu(IGBT, MOSFET, RF kunye neepakethe ze-microwave)
IiDiode zeLaser kunye nezixhobo ze-Optoelectronic
Iinkqubo zokuPholisa zeAerospace kunye nezoKhuselo
Ii-LED Heat Spreaders ezisebenza kakuhle
Iisinki zobushushu ze-IC kunye ne-CPU zeKhompyutha ePhambili
Izixhobo zokukhulisa amandla kunye nezixhobo zonxibelelwano lwe-Optical

Kutheni Ukhetha I-Diamond-Copper Composite?

Kubaizinto ezichaphazela ubushushu.
Ngexesha lokunciphisa amandla kunye noxinano olukhulu lwamandla, ukulawula ubushushu kuqinisekisa ngokufanelekileyo ixesha lokusebenza kunye nokusebenza kwesixhobo ngasinye.
I-Cu-Diamond composite iqinisekisa ukuba:

Ixesha elide lobomi besixhobo
Uzinzo oluphuculweyo lokusebenza
Ukuphuculwa kokusebenza kakuhle kwamandla
Ukudinwa okuncitshisiweyo kobushushu

Imibuzo ebuzwa rhoqo ngeeGlasi zeQuartz

Q1: Ngaba ii-Cu-Diamond composites zingenziwa ngokwezifiso kwizixhobo ezithile ze-chip?
Ewe. Iqhekeza levolumu yedayimani kunye ne-CTE zinokulungiswa ngokuchanekileyo ukuze zihambelane nezixhobo ezisekwe kwi-Si, GaN, okanye kwi-SiC.

Umbuzo 2: Ngaba i-metallization iyadingeka ngaphambi kokuba kufakwe i-solder?
Ewe. Ukwenziwa kwesinyithi kumphezulu (iNi/Au, iTi/Ni/Au) kuyacetyiswa ukuqinisekisa ukubopha okuhle kakhulu kunye nokumelana okuncinci kobushushu.

Umbuzo 3: Isebenza njani phantsi kweemeko zobushushu obuphezulu okanye obuhamba ngokukhawuleza?
Ukusasazwa kobushushu okuphezulu kweDayimani kuqinisekisa ukulingana kobushushu ngokukhawuleza, okwenza ukuba ilungele izixhobo ezisebenzisa amaza amaninzi kunye ne-pulse-loaded.

Q4: Ingakanani iqondo lobushushu lokusebenza eliphezulu?
I-composite ihlala izinzile ukuya kuthi ga600°Ckwiindawo ezingasebenziyo okanye ezingenamoya, kuxhomekeke kwindlela yokugquma kunye ne-bonding interface.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.