Ibhokisi yokuthumela evulekileyo engaphambili eyi-12 intshi （300mm） Ibhokisi yokuthwala i-wafer ye-FOSB enomthamo we-25pcs wokuphatha nokuthumela i-wafer Imisebenzi ezenzekelayo
Ezona mpawu
| Uphawu | Inkcazo |
| Umthamo weWafer | Izithuba ezingama-25kwiiwafers ezingama-300mm, ezibonelela ngesisombululo esinoxinano olukhulu sokuthutha nokugcina iiwafers. |
| Ukuthobela imithetho | NgokupheleleyoI-SEMI/FIMSkwayeI-AMHSiyahambelana, iqinisekisa ukuhambelana neenkqubo zokuphatha izinto ezizenzekelayo kwi-semiconductor fabs. |
| Imisebenzi Ezenzekelayo | Yenzelweukuphathwa ngokuzenzekelayo, ukunciphisa ukusebenzisana kwabantu kunye nokunciphisa iingozi zongcoliseko. |
| Ukhetho Lokuphatha Ngesandla | Inika ukuguquguquka kokufikelela ngesandla kwiimeko ezifuna ukungenelela komntu okanye ngexesha leenkqubo ezingezizo ezenzekelayo. |
| Ukwakhiwa kwezinto | Yenziwe ngeizixhobo ezicocekileyo kakhulu nezikhupha igesi kancinci, ukunciphisa umngcipheko wokuveliswa kweesuntswana kunye nongcoliseko. |
| Inkqubo Yokugcina I-Wafer | Phambiliinkqubo yokugcina i-waferkunciphisa umngcipheko wokuhamba kwe-wafer ngexesha lokuthuthwa, kuqinisekisa ukuba ii-wafer zihlala zikhuselekile. |
| Uyilo lococeko | Yenzelwe ngokukodwa ukunciphisa umngcipheko wokuveliswa kweesuntswana kunye nongcoliseko, igcina imigangatho ephezulu efunekayo kwimveliso ye-semiconductor. |
| Ukuqina kunye namandla | Yakhiwe ngezinto ezinamandla aphezulu ukumelana nobunzima bokuthutha ngelixa igcina ulwakhiwo lwesithuthi luqinile. |
| Ukwenziwa ngokwezifiso | Iziboneleloiindlela zokwenza ngokwezifisokwiisayizi ezahlukeneyo ze-wafer okanye iimfuno zothutho, okuvumela abathengi ukuba balungiselele ibhokisi ngokweemfuno zabo. |
Iimpawu ezineenkcukacha
Umthamo weSlot ezingama-25 weeWafers ezingama-300mm
I-wafer carrier ye-eFOSB yenzelwe ukuhlalisa ii-wafers ezingama-25 300mm, apho indawo nganye ibekwe ngokuchanekileyo ukuqinisekisa ukuba i-wafer ibekwe kakuhle. Uyilo luvumela ii-wafers ukuba zibekwe ngokufanelekileyo ngelixa zithintela ukudibana phakathi kwee-wafers, ngaloo ndlela kunciphisa umngcipheko wokukrweleka, ungcoliseko, okanye umonakalo woomatshini.
Ukuphathwa Okuzenzakalelayo
Ibhokisi ye-eFOSB yenzelwe ukusetyenziswa neenkqubo zokuphatha izinto ezizenzekelayo (i-AMHS), ezinceda ekwenzeni lula ukuhamba kwe-wafer kunye nokwandisa ukuveliswa kwemveliso ye-semiconductor. Ngokuzenzekela le nkqubo, iingozi ezinxulumene nokuphathwa ngabantu, njengongcoliseko okanye umonakalo, zincitshiswa kakhulu. Uyilo lwebhokisi ye-eFOSB luqinisekisa ukuba inokuphathwa ngokuzenzekelayo kokubini kwindlela ethe tye nethe nkqo, nto leyo eququzelela inkqubo yokuthutha egudileyo nethembekileyo.
Ukhetho Lokuphatha Ngesandla
Nangona ukuzenzekela kubekwe phambili, ibhokisi ye-eFOSB ikwahambelana neendlela zokuphatha ngesandla. Olu sebenziso lubini luluncedo kwiimeko apho kufuneka khona ukungenelela komntu, njengaxa kufuduselwa ii-wafers kwiindawo ezingenazo iinkqubo ezizenzekelayo okanye kwiimeko ezifuna ukuchaneka okanye ukunakekelwa okungakumbi.
Izinto ezicocekileyo kakhulu nezingangenisi igesi eninzi
Izinto ezisetyenzisiweyo kwibhokisi ye-eFOSB zikhethwe ngokukodwa ngenxa yeempawu zazo zokukhupha igesi ephantsi, ezithintela ukukhutshwa kweekhompawundi eziguquguqukayo ezinokungcolisa ii-wafers. Ukongeza, ezi zinto ziyakwazi ukumelana kakhulu namasuntswana, nto leyo ebaluleke kakhulu ekuthinteleni ungcoliseko ngexesha lokuthuthwa kwee-wafers, ngakumbi kwiindawo apho ucoceko lubaluleke kakhulu.
Ukuthintela Ukuveliswa Kwamasuntswana
Uyilo lwebhokisi luquka iimpawu ezijolise ngokukodwa ekuthinteleni ukuveliswa kwamasuntswana ngexesha lokuphathwa. Oku kuqinisekisa ukuba ii-wafers zihlala zingenangcoliseko, nto leyo ibalulekileyo ekwenziweni kwee-semiconductor apho namasuntswana amancinci anokubangela iziphene ezinkulu.
Ukuqina kunye nokuthembeka
Ibhokisi ye-eFOSB yenziwe ngezinto ezihlala ixesha elide ezinokumelana noxinzelelo lomzimba lokuthuthwa, ukuqinisekisa ukuba ibhokisi igcina ulwakhiwo lwayo ngokuhamba kwexesha. Olu qina lunciphisa isidingo sokutshintshwa rhoqo, nto leyo eyenza ukuba ibe sisisombululo esingabizi kakhulu ekuhambeni kwexesha.
Iinketho zokwenza ngokwezifiso
Ukuqonda ukuba yonke imigca yemveliso ye-semiconductor inokuba neemfuno ezizodwa, ibhokisi ye-eFOSB wafer carrier inikezela ngeendlela zokwenza ngokwezifiso. Nokuba kukulungisa inani leendawo zokubeka, ukuguqula ubungakanani bebhokisi, okanye ukufaka izixhobo ezikhethekileyo, ibhokisi ye-eFOSB inokulungiswa ukuze ihlangabezane neemfuno ezithile zabathengi.
Izicelo
IIbhokisi yoThutho evulekileyo ngaphambili eyi-12-intshi (300mm) (eFOSB)Yenzelwe ukusetyenziswa kwiintlobo ngeentlobo zezicelo ngaphakathi kwishishini le-semiconductor, kuquka:
Ukuphathwa kweWafer yeSemiconductor
Ibhokisi ye-eFOSB ibonelela ngendlela ekhuselekileyo nefanelekileyo yokuphatha ii-wafers ezingama-300mm kuzo zonke izigaba zemveliso, ukusuka ekuvelisweni kokuqala ukuya kuvavanyo kunye nokupakishwa. Inciphisa umngcipheko wokungcola kunye nomonakalo, nto leyo ibalulekileyo ekuvelisweni kwee-semiconductor apho ukuchaneka kunye nococeko kubalulekile.
Indawo yokugcina iWafer
Kwiindawo zokwenziwa kwee-semiconductor, ii-wafers kufuneka zigcinwe phantsi kweemeko ezingqongqo ukuze zihlale zisemgangathweni. I-eFOSB carrier iqinisekisa ukugcinwa okukhuselekileyo ngokubonelela ngendawo ekhuselekileyo, ecocekileyo, nezinzileyo, inciphisa umngcipheko wokonakala kwee-wafer ngexesha lokugcinwa.
Uthutho
Ukuthutha ii-wafers ze-semiconductor phakathi kwezixhobo ezahlukeneyo okanye ngaphakathi kwe-fabs kufuna ukupakishwa okukhuselekileyo ukukhusela ii-wafers ezibuthathaka. Ibhokisi ye-eFOSB inika ukhuseleko olufanelekileyo ngexesha lokuthuthwa, iqinisekisa ukuba ii-wafers zifika zingonakalanga, zigcina imveliso iphezulu.
Ukuhlanganiswa ne-AMHS
Ibhokisi ye-eFOSB ifanelekile ukusetyenziswa kwiifektri ze-semiconductor zanamhlanje, ezizenzekelayo, apho ukuphathwa kwezinto ngokufanelekileyo kubalulekile. Ukuhambelana kwebhokisi ne-AMHS kwenza kube lula ukuhamba ngokukhawuleza kwee-wafers ngaphakathi kwemigca yemveliso, kukhulisa imveliso kwaye kunciphisa iimpazamo zokuphatha.
Amagama angundoqo e-FOSB Imibuzo neempendulo
Umbuzo 1: Yintoni eyenza ibhokisi ye-eFOSB ifaneleke ukuphathwa kwe-wafer kwimveliso ye-semiconductor?
A1:Ibhokisi ye-eFOSB yenzelwe ngokukodwa ii-wafers ze-semiconductor, ibonelela ngendawo ekhuselekileyo nezinzileyo yokuphathwa kwazo, ukugcinwa kwazo, kunye nokuthuthwa kwazo. Ukuthobela kwayo imigangatho ye-SEMI/FIMS kunye ne-AMHS kuqinisekisa ukuba idibana kakuhle neenkqubo ezizenzekelayo. Izixhobo zebhokisi ezicocekileyo kakhulu, ezingasebenzisi igesi eninzi kunye nenkqubo yokugcina ii-wafer kunciphisa umngcipheko wokungcola kwaye kuqinisekisa ukuthembeka kwe-wafer kuyo yonke inkqubo.
Umbuzo 2: Ibhokisi ye-eFOSB ithintela njani ungcoliseko ngexesha lokuthuthwa kwe-wafer?
A2:Ibhokisi ye-eFOSB yenziwe ngezinto ezimelana nokuphuma kwegesi, nto leyo ethintela ukukhutshwa kweekhompawundi eziguquguqukayo ezinokungcolisa ii-wafers. Uyilo lwayo lukwanciphisa ukuveliswa kwee-particles, kwaye inkqubo yokugcina ii-wafer ikhusela ii-wafers endaweni yazo, inciphisa umngcipheko wokonakala koomatshini kunye nongcoliseko ngexesha lokuthuthwa.
Umbuzo 3: Ngaba ibhokisi ye-eFOSB ingasetyenziswa kwiinkqubo zesandla neze-automated?
A3:Ewe, ibhokisi ye-eFOSB inokusetyenziswa ngeendlela ezahlukeneyo kwaye ingasetyenziswa kuzo zombiniiinkqubo ezizenzekelayokunye neemeko zokuphathwa ngesandla. Yenzelwe ukuphathwa ngokuzenzekelayo ukunciphisa ukungenelela kwabantu, kodwa ikwavumela ukufikelela ngesandla xa kuyimfuneko.
Umbuzo 4: Ngaba ibhokisi ye-eFOSB inokwenziwa ngokwezifiso kwiisayizi ezahlukeneyo ze-wafer?
A4:Ewe, ibhokisi ye-eFOSB iyabonelelaiindlela zokwenza ngokwezifisoukulungiselela ubungakanani obahlukeneyo be-wafer, uqwalaselo lweslothi, okanye iimfuno ezithile zokuphatha, ukuqinisekisa ukuba iyahlangabezana neemfuno ezizodwa zemigca eyahlukeneyo yemveliso ye-semiconductor.
Umbuzo 5: Ibhokisi ye-eFOSB iphucula njani ukusebenza kakuhle kokuphatha iiwafer?
A5:Ibhokisi ye-eFOSB iphucula ukusebenza kakuhle ngokuvumelaimisebenzi ezenzekelayo, ukunciphisa isidingo sokungenelela ngesandla kunye nokwenza lula ukuthuthwa kwe-wafer ngaphakathi kwe-semiconductor fab. Uyilo lwayo lukwaqinisekisa ukuba ii-wafer zihlala zikhuselekile, zinciphisa iimpazamo zokuphatha kwaye ziphucula imveliso iyonke.
Isiphelo
Ibhokisi yoThutho evulekileyo ngaphambili eyi-12-intshi (300mm) (eFOSB) sisisombululo esithembekileyo nesisebenzayo sokuphatha iiwafer, ukugcina, kunye nokuthuthwa kwimveliso yee-semiconductor. Ngeempawu zayo eziphambili, ukuthobela imigangatho yoshishino, kunye nokuguquguquka, inika abavelisi bee-semiconductor indlela esebenzayo yokukhusela ukuthembeka kweewafer kunye nokwenza ngcono ukusebenza kakuhle kwemveliso. Nokuba kukuphathwa ngokuzenzekelayo okanye ngesandla, ibhokisi ye-eFOSB ihlangabezana neemfuno ezingqongqo zoshishino lwee-semiconductor, iqinisekisa ukuthuthwa kweewafer ngaphandle kongcoliseko kunye nokonakala kuzo zonke izigaba zenkqubo yemveliso.
Umzobo oneenkcukacha
