Ithetha ntoni iTTV, BOW, WARP, kunye neTIR kwiiWafers?

Xa sivavanya ii-silicone ze-semiconductor okanye ii-substrates ezenziwe kwezinye izinto, sihlala sidibana nezalathi zobugcisa ezifana ne-TTV, BOW, WARP, kwaye mhlawumbi i-TIR, STIR, LTV, phakathi kwabanye. Zeziphi iiparamitha ezimele ezi?

I-TTV - Ukwahluka koButyebe ngokupheleleyo
IQINISO - Saphetha
I-WARP - i-Wap
I-TIR — Ufundo Olupheleleyo Olubonisiweyo
I-STIR - ISiza siBonke esiBonelelwe ukuFunda
I-LTV-Ukwahluka koButyenene beNdawo

1. Ukwahluka koButyebe ngokupheleleyo — TTV

Umahluko phakathi kobukhulu kunye nobukhulu obuncinci be-wafer ngokubhekiselele kwindiza yereferensi xa i-wafer iboshiwe kwaye idibene ngokusondeleyo. Ngokuqhelekileyo ibonakaliswe kwii-micrometers (μm), idla ngokumelwa njenge: ≤15 μm.

2. Saphetha - ISIQEPHU

Ukutenxa phakathi kobuncinci kunye nomgama omde ukusuka kwindawo esembindini ye-wafer surface ukuya kwinqwelo-moya yokukhangela xa i-wafer ikwimeko yamahhala (engabanjwanga). Oku kubandakanya zombini i-concave (i-negative bow) kunye neemeko ze-convex (i-positive bow). Ngokuqhelekileyo ibonakaliswe kwii-micrometers (μm), rhoqo imelwe njenge: ≤40 μm.

3. I-Wap

Ukutenxa phakathi kobuncinci kunye nomgama omde ukusuka kwi-wafer surface ukuya kwi-plane yereferensi (ngokuqhelekileyo indawo yangasemva ye-wafer) xa i-wafer ikwimeko yamahhala (engafakwanga). Oku kubandakanya zombini iimeko zeconcave (negative warp) kunye neconvex (positive warp). Ngokuqhelekileyo ibonakaliswe kwii-micrometers (μm), idla ngokumelwa njenge: ≤30 μm.

4. UkuFunda okupheleleyo okuBonelweyo — TIR

Xa i-wafer ixinzelelwe kwaye inxibelelana ngokusondeleyo, isebenzisa inqwelo-moya yesalathiso enciphisa isixa-mali se-intercepts yazo zonke iingongoma ngaphakathi kwendawo esemgangathweni okanye ummandla ochaziweyo wendawo kwi-wafer surface, i-TIR kukutenxa phakathi komgama ophezulu kunye nomncinci ukusuka kumphezulu we-wafer ukuya kule nqwelo-moya.

Isekwe kubuchwephesha obunzulu kwiinkcukacha zemathiriyeli ye-semiconductor ezifana ne-TTV, BOW, WARP, kunye ne-TIR, i-XKH ibonelela ngeenkonzo ezichanekileyo zokusetyenzwa kwe-wafer ezenzelwe imigangatho engqongqo yoshishino. Sinikezela kwaye sixhasa uluhlu olubanzi lwezinto eziphezulu zokusebenza ezibandakanya isafire, i-silicon carbide (i-SiC), ii-silicon wafers, i-SOI, kunye ne-quartz, ukuqinisekisa ukukhanya okungaqhelekanga, ukuguquguquka kobunzima, kunye nomgangatho womgangatho wezicelo eziphambili kwi-optoelectronics, izixhobo zamandla kunye ne-MEMS. Sithembe ukuba sinikezela ngezisombululo zemathiriyeli ezithembekileyo kunye nomatshini ochanekileyo ohlangabezana neemfuno zakho zoyilo olufuna kakhulu.