Ngenxa yophuhliso oluqhubekayo lwetekhnoloji ye-semiconductor, kwishishini le-semiconductor kwanakwishishini le-photovoltaic, iimfuno zomgangatho womphezulu we-wafer substrate okanye i-epitaxial sheet nazo zingqongqo kakhulu. Ngoko ke, zithini iimfuno zomgangatho we-wafers?i-wafer yesafireUmzekelo, zeziphi izalathisi ezinokusetyenziswa ukuvavanya umgangatho womphezulu wee-wafers?
Zithini izalathi zovavanyo lwee-wafers?
Izalathisi ezintathu
Kwii-wafers zesafire, izalathisi zazo zovavanyo zii-total thickness deviation (TTV), i-bend (Bow) kunye ne-Warp (Warp). Ezi parameters zintathu zidibene zibonisa ukufana kwe-flatness kunye nobukhulu be-silicon wafer, kwaye zinokulinganisa inqanaba le-ripple ye-wafer. I-corrugation ingadityaniswa ne-flatness ukuvavanya umgangatho womphezulu we-wafer.
Yintoni i-TTV, i-BOW, i-Warp?
I-TTV (Utshintsho loBukhulu obupheleleyo)
I-TTV ngumahluko phakathi kobukhulu obukhulu nobuncinci be-wafer. Le parameter yi-index ebalulekileyo esetyenziselwa ukulinganisa ukufana kobukhulu be-wafer. Kwinkqubo ye-semiconductor, ubukhulu be-wafer kufuneka bufane kakhulu phezu komphezulu wonke. Umlinganiselo udla ngokwenziwa kwiindawo ezintlanu kwi-wafer kwaye umahluko uyabalwa. Ekugqibeleni, eli xabiso lisisiseko esibalulekileyo sokugweba umgangatho we-wafer.
Ukuqubuda
I-Bow kwimveliso ye-semiconductor ibhekisa ekugobeni kwe-wafer, ikhulula umgama phakathi kwendawo ephakathi kwe-wafer engafakwanga kunye ne-reference plane. Eli gama mhlawumbi livela kwinkcazo yesimo sento xa igobile, njengesimo esigobileyo se-saw. Ixabiso le-Bow lichazwa ngokulinganisa ukuphambuka phakathi kombindi kunye nomphetho we-wafer ye-silicon. Eli xabiso lidla ngokubonakaliswa kwi-micrometers (µm).
I-Warp
I-Warp yipropati yehlabathi yee-wafers ezilinganisa umahluko phakathi komgama ophezulu nomncinci phakathi kombindi we-wafer evulekileyo ngokukhululekileyo kunye ne-reference plane. Imele umgama ukusuka kumphezulu we-wafer ye-silicon ukuya kwi-plane.
Yintoni umahluko phakathi kweTTV, iBow, neWarp?
I-TTV igxile kutshintsho kubukhulu kwaye ayikhathali ngokugoba okanye ukugqwetheka kwe-wafer.
I-Bow igxile kwigophe iyonke, ikakhulu xa ucinga ngokugoba kwenqaku eliphakathi kunye nomphetho.
I-Warp ibanzi ngakumbi, kuquka ukugoba nokujika umphezulu we-wafer yonke.
Nangona ezi parameter zintathu zinxulumene nemilo kunye neempawu zejiyometri ze-silicon wafer, zilinganiswa kwaye zichazwa ngokwahlukileyo, kwaye impembelelo yazo kwinkqubo ye-semiconductor kunye nokucutshungulwa kwe-wafer nazo zahlukile.
Okukhona iiparameter ezintathu zincinci, kokukhona zingcono, kwaye okukhona iparameter inkulu, kokukhona impembelelo embi kwinkqubo ye-semiconductor inkulu. Ke ngoko, njengengcali ye-semiconductor, kufuneka siqonde ukubaluleka kweeparameter zeprofayili ye-wafer kwinkqubo yonke yenkqubo, senze inkqubo ye-semiconductor, kwaye sinikele ingqalelo kwiinkcukacha.
(ukuhlalutya)
Ixesha leposi: Juni-24-2024