Ngophuhliso oluqhubekayo lwetekhnoloji ye-semiconductor, kwishishini le-semiconductor kunye nakwishishini le-photovoltaic, iimfuno zomgangatho womphezulu we-wafer substrate okanye iphepha le-epitaxial nazo zingqongqo kakhulu. Ke, zithini iimfuno zomgangatho wee-wafers? Ukuthathaiqhekezana lesafires njengomzekelo, zeziphi izikhombisi ezinokusetyenziswa ukuvavanya umgangatho womphezulu wee-wafers?
Ziziphi iimpawu zovavanyo lweewafers?
Izalathi eziNtathu
Kwimisonto yesafire, izikhombisi zayo zovavanyo kukutenxa ngokupheleleyo (TTV), ukugoba (iSaphetha) kunye neWarp (Warp). Ezi parameters zintathu xa zidibene zibonisa ukucaba kunye nokulingana kobungqingqwa be-silicon, kwaye inokulinganisa inqanaba le-ripple ye-wafer. I-corrugation inokudityaniswa kunye nokuthe tyaba ukuvavanya umgangatho we-wafer surface.
Yintoni i-TTV, BOW, Warp?
I-TTV (Ukwahluka koButyebe bubonke)
I-TTV ngumahluko phakathi kobukhulu kunye nobuncinci ubukhulu be-wafer. Le parameter sisalathiso esibalulekileyo esisetyenziselwa ukulinganisa ukufana kobunzima bewafer. Kwinkqubo ye-semiconductor, ubukhulu be-wafer kufuneka bufane kakhulu phezu komhlaba wonke. Ukulinganisa ngokuqhelekileyo kwenziwa kwiindawo ezintlanu kwi-wafer kwaye umehluko ubalwa. Ekugqibeleni, eli xabiso sisiseko esibalulekileyo sokugweba umgangatho we-wafer.
Ukuqubuda
I-Bow ekwenzeni i-semiconductor ibhekiselele ekugobeni kwe-wafer, ukukhulula umgama phakathi kwendawo ephakathi ye-wafer engafakwanga kunye nenqwelo-moya yereferensi. Eli gama lisenokuba livela kwinkcazelo yokumila kwento xa igobile, njengesaphetha. Ixabiso le-Bow lichazwa ngokulinganisa ukutenxa phakathi kombindi kunye nomphetho we-wafer ye-silicon. Eli xabiso liqhele ukubonakaliswa ngeemicrometers (µm).
I-Wap
IWarp yipropathi yehlabathi yeewafers ezilinganisa umahluko phakathi kowona mkhulu kunye nomgama omncinci phakathi kombindi wewafa ekhululekileyo engafakwanga kunye nenqwelomoya yereferensi. Imele umgama ukusuka kumphezulu we-silicon wafer ukuya kwinqwelomoya.
Yintoni umahluko phakathi kweTTV, iBow, Warp?
I-TTV igxile kutshintsho kubukhulu kwaye ayikhathaleli ukugoba okanye ukugqwethwa kwe-wafer.
I-Bow igxininise kwi-bend jikelele, ngokukodwa ngokuqwalasela i-bend yenqaku eliphakathi kunye nomda.
I-Warp ibanzi ngakumbi, kubandakanya ukugoba kunye nokujijwa kwawo wonke umphezulu we-wafer.
Nangona ezi parameters zintathu zihambelana nemilo kunye neepropati zejometri ze-silicon wafer, zilinganiswa kwaye zichazwe ngokwahlukileyo, kwaye impembelelo yazo kwinkqubo ye-semiconductor kunye ne-wafer processing nayo yahlukile.
Incinci iparameters ezintathu, ngcono, kwaye inkulu iparameter, inkulu impembelelo embi kwinkqubo ye-semiconductor. Ngoko ke, njengengcali ye-semiconductor, kufuneka siqonde ukubaluleka kweeparamitha zeprofayili ye-wafer kuyo yonke inkqubo yenkqubo, yenza inkqubo ye-semiconductor, kufuneka sinikele ingqalelo kwiinkcukacha.
(ukuhlola)
Ixesha lokuposa: Jun-24-2024