Ngophuhliso oluqhubekayo lwetekhnoloji ye-semiconductor, kwishishini le-semiconductor kunye nakwishishini le-photovoltaic, iimfuno zomgangatho womphezulu we-wafer substrate okanye iphepha le-epitaxial nazo zingqongqo kakhulu.Ke, zithini iimfuno zomgangatho wee-wafers?Ukuthatha ii-wafers zesafire njengomzekelo, zeziphi izikhombisi ezinokusetyenziselwa ukuvavanya umgangatho womphezulu weewafers?
Ziziphi iimpawu zovavanyo lweewafers?
Izalathi eziNtathu
Kwimisonto yesafire, izikhombisi zayo zovavanyo kukutenxa ngokupheleleyo (TTV), ukugoba (iSaphetha) kunye neWarp (Warp).Ezi parameters zintathu xa zidibene zibonisa ukucaba kunye nokulingana kobungqingqwa be-silicon, kwaye inokulinganisa inqanaba le-ripple ye-wafer.I-corrugation inokudibaniswa kunye nokuthe tyaba ukuvavanya umgangatho we-wafer surface.
Yintoni i-TTV, BOW, Warp?
I-TTV (Ukwahluka koButyebe bubonke)
I-TTV ngumahluko phakathi kobukhulu kunye nobuncinci ubukhulu be-wafer.Le parameter sisalathiso esibalulekileyo esisetyenziselwa ukulinganisa ukufana kobunzima bewafer.Kwinkqubo ye-semiconductor, ubukhulu be-wafer kufuneka bufane kakhulu phezu komhlaba wonke.Ukulinganisa ngokuqhelekileyo kwenziwa kwiindawo ezintlanu kwi-wafer kwaye umehluko ubalwa.Ekugqibeleni, eli xabiso lisisiseko esibalulekileyo sokugweba umgangatho we-wafer.
Ukuqubuda
I-Bow ekwenzeni i-semiconductor ibhekiselele ekugobeni kwe-wafer, ukukhulula umgama phakathi kwendawo ephakathi ye-wafer engafakwanga kunye nenqwelo-moya yereferensi.Eli gama lisenokuba livela kwingcaciso yokumila kwento xa igobile, njengesaphetha.Ixabiso le-Bow lichazwa ngokulinganisa ukutenxa phakathi kombindi kunye nomphetho wewafer yesilicon.Eli xabiso liqhele ukubonakaliswa ngeemicrometers (µm).
I-Wap
IWarp yipropathi yehlabathi yeewafers ezilinganisa umahluko phakathi kowona mkhulu kunye nomgama omncinci phakathi kombindi wewafa ekhululekileyo engafakwanga kunye nenqwelomoya yereferensi.Imele umgama ukusuka kumphezulu we-silicon wafer ukuya kwinqwelomoya.
Yintoni umahluko phakathi kweTTV, iBow, Warp?
I-TTV igxile kutshintsho kubukhulu kwaye ayikhathaleli ukugoba okanye ukugqwethwa kwe-wafer.
I-Bow igxininise kwi-bend jikelele, ngokukodwa ngokuqwalasela i-bend yenqaku eliphakathi kunye nomda.
I-Warp ibanzi ngakumbi, kubandakanya ukugoba kunye nokujijwa kwawo wonke umphezulu we-wafer.
Nangona ezi parameters zintathu zihambelana nemilo kunye neepropati zejometri ze-silicon wafer, zilinganiswa kwaye zichazwe ngokwahlukileyo, kwaye impembelelo yazo kwinkqubo ye-semiconductor kunye ne-wafer processing nayo yahlukile.
Incinci iparameters ezintathu, ngcono, kwaye inkulu iparameter, inkulu impembelelo embi kwinkqubo ye-semiconductor.Ngoko ke, njengengcali ye-semiconductor, kufuneka siqonde ukubaluleka kweeparamitha zeprofayili ye-wafer kuyo yonke inkqubo yenkqubo, yenza inkqubo ye-semiconductor, kufuneka sinikele ingqalelo kwiinkcukacha.
(ukuhlola)
Ixesha lokuposa: Jun-24-2024