Iglasi Iba Liqonga Elitsha Lokupakisha

Iglasi ikhawuleza ukubaizixhobo zeqongakwiimarike zesiphelo ezikhokelwa yiamaziko edathakwayeunxibelelwanoNgaphakathi kwiziko ledatha, ixhasa iipakethe ezimbini eziphambili:uyilo lweetshiphusikwayeigalelo/imveliso ebonakalayo (I/O).

Yayoi-coefficient ephantsi yokwandiswa kobushushu (CTE)kwayeii-glass carriers ezihambelana ne-deep ultraviolet (DUV)ndivumeleukudibanisa okuxutyiweyokwayeUkucutshungulwa kwecala elingasemva le-300 mm le-wafer encinciukuze kube yimijelo yokuvelisa esemgangathweni.

Njengoko iimodyuli zeswitshi kunye ne-accelerator zikhula ngaphaya kobukhulu be-wafer-stepper,abathwali bepaneliziya zisiba yinto engenakuphepheka. Imakethi yeii-substrates zeglasi ezingundoqo (i-GCS)kulindeleke ukuba ifikeleleI-460 yezigidi zeerandi ngo-2030, kunye noqikelelo oluthembisayo olubonisa ukuba kuza kwamkelwa ngokubanzi2027–2028Okwangoku,izixhobo zokudibanisa iglasikulindeleke ukuba zidluleIzigidi ezingama-400 zeerandinangona kucingelwa ukuba izinto azilunganga, kwayeicandelo lokuthwala iglasi elizinzileyoimele imakethi ejikelezeIzigidi ezingama-500 zeerandi.

In ukupakishwa okuphambili, iglasi iguquke ekubeni yinto elula yaya ekubeni yintoishishini leqongaNgokubaiikharityhulam zokuphatha iiglasi, ukuveliswa kwengeniso kuyatshintsha ukusukaamaxabiso ngokwephaneli nganye to uqoqosho ngomjikelo ngamnye, apho inzuzo ixhomekekesebenzisa kwakhona imijikelo, isivuno sokukhupha i-laser/UV, isivuno senkqubokunyeukunciphisa umonakalo obangelwa ngumphethoOlu ncedo lunamandla olunikezelwa ngababoneleliIipotifoliyo ezikumgangatho we-CTE, ababoneleli ngeebhantiukuthengisa iinqwaba ezidibeneyoumthwali + iglu/i-LTHC + i-debondkunyeabathengisi bokubuyisela izinto zengingqiingcali ekuqinisekiseni umgangatho wokukhanya.

Iinkampani ezinolwazi olunzulu ngeglasi—ezifanaIsicwangciso se-Optik, eyaziwa ngokubaabathwali abathe tyaba kakhulukunyeiijometri zomphetho wobunjinelikwayeuthumelo olulawulwayo—zibekwe kwindawo efanelekileyo kweli khonkco lexabiso.

Ii-substrates zeglasi ezingundoqo ngoku zivula amandla okuvelisa iiphaneli zokubonisa zibe yinzuzo ngokusebenzisaI-TGV (NgeGlasi Ngendlela), i-RDL entle (Umaleko woSasazo kwakhona)kunyeiinkqubo zokwakhaIinkokheli zemarike ngabo bayazi kakuhle iindlela ezibalulekileyo zokunxibelelana:

• Ukubhola/ukukrola i-TGV enemveliso ephezulu

• Ukuzaliswa kobhedu okungenamsebenzi

• I-lithography yephaneli enokulungelelaniswa okuhlengahlengiswayo

• 2/2 µm L/S (umgca/indawo)ukwenza iipateni

• Ubuchwepheshe bokuphatha iiphaneli ezilawulwa yi-warp

Abathengisi be-substrate kunye ne-OSAT abasebenzisana nabavelisi beglasi yokubonisa bayaguqulaumthamo wendawo enkuluukungenaiingenelo zexabiso lokupakisha ngobukhulu bepaneli.

Ukusuka kwiCarrier ukuya kwiZixhobo zePlatform eziGcweleyo

Iglasi itshintshile ukusuka kwiumthwali wexeshanakwiiqonga lezinto ezibanzingenxaukupakishwa okuphambili, ukuhambelana ne-megatrends ezifanaukuhlanganiswa kwe-chiplet, ukwenziwa kweephaneli, ukunqwabelanisa ngokuthe nkqokunyeukudibanisa okuxutyiweyo—ngexesha elinye kuqiniswa uhlahlo-lwabiwo malioomatshini, ubushushukunyeigumbi lokucocaukusebenza.

Njengeumthwali(zombini i-wafer kunye nephaneli),iglasi ecacileyo, ene-CTE ephantsiyenza ukubaulungelelwaniso oluncitshisiweyo loxinzelelokwayeukususwa kwe-laser/UV, ukuphucula isivunoiiwafers ezingaphantsi kwe-50 µm, ukuhamba kwenkqubo ngasemvakunyeiiphaneli ezakhiwe ngokutsha, ngaloo ndlela kufezekiswa ukusebenza kakuhle kweendleko ezisetyenziswa ngeendlela ezininzi.

Njengeisiseko seglasi esingundoqo, ithatha indawo yee-organic cores kunye neenkxasoimveliso yomgangatho wephaneli.

• Ii-TGVukubonelela ngamandla angqingqwa athe nkqo kunye nokuhanjiswa kwemiqondiso.

• I-SAP RDLityhala imida yocingo2/2 µm.

• Iindawo ezithe tyaba, ezinokulungiswa yi-CTEukunciphisa i-warpage.

• Ukubonakala okubonakalayoilungiselela isiseko se-substratei-optics ehlanganisiweyo (i-CPO).
  Okwangoku,ukusasazwa kobushushuimingeni ijongwa ngokusebenzisaiindiza zobhedu, ii-vias ezithungiweyo, iinethiwekhi zokuhambisa umbane ezingasemva (BSPDN)kunyeukupholisa okumacala amabini.

Njengeisixhobo sokudibanisa iglasi, le nto iphumelela phantsi kweendlela ezimbini ezahlukeneyo:

• Imo yokusebenza, evumela uyilo olukhulu lwe-2.5D AI/HPC kunye nolwakhiwo lweswitshi olufikelela kuxinano lweentambo kunye nokubalwa kwamaqhuqhuva okungenakufikelelwa yi-silicon ngexabiso elifanayo kunye nendawo.

• Imo esebenzayo, ukudibanisaI-SIW/izihluzi/ii-antennakwayeimisele eyenziwe ngesinyithi okanye izikhokelo zamaza ezibhalwe nge-laserngaphakathi kwe-substrate, iindlela ze-RF ezigoqekayo kunye nokuhambisa i-optical I/O ukuya emngceleni ngelahleko encinci.

Imbonakalo yeMarike kunye neNdlela eziSebenza ngayo

Ngokutsho kohlalutyo lwamva nje olwenziwe nguIqela leYole, izinto zeglasi ziye zabaeyona nto iphambili kuguquko lokupakisha lwe-semiconductor, eqhutywa ziindlela eziphambili kwiubukrelekrele bokwenziwa (AI), ikhompyutha esebenza kakhulu (i-HPC), Uqhagamshelo lwe-5G/6Gkunyei-optics ehlanganisiweyo (i-CPO).

Abahlalutyi bagxininisa ukuba iglasiiipropati ezizodwa—kuqukai-CTE ephantsi, uzinzo oluphezulu olunemilinganiselokunyeukucaca okubonakalayo—yenza ibe yinto ebalulekileyo ekuhlangabezaneniiimfuno zoomatshini, zombane, nezobushushuyeepakethe zesizukulwana esilandelayo.

UYole uqhubeka athiamaziko edathakwayeucingohlalaiinjini zokukhula eziphambiliukuze iglasi isetyenziswe kwiphakheji, ngelixaiimoto, ukhuselokunyeizixhobo ze-elektroniki zabathengi abakumgangatho ophezuluLa macandelo axhomekeke ngakumbi kuukuhlanganiswa kwe-chiplet, ukudibanisa okuxutyiweyokunyeimveliso yomgangatho wephaneli, apho iglasi ingapheleli nje ekuphuculeni ukusebenza kodwa ikwanciphisa neendleko zizonke.

Ekugqibeleni, ukuvela kweimixokelelwane emitsha yokubonelela eAsia—ingakumbi kwiITshayina, iSouth Korea, kunye neJapan—ichongwa njengesixhobo esibalulekileyo sokwandisa imveliso kunye nokuqinisainkqubo yendalo yehlabathi yeglasi yokupakisha ephucukileyo.