Ukususela ngeminyaka yoo-1980, uxinano lokudibanisa iisekethe ze-elektroniki luye lwanda ngesantya sonyaka se-1.5× okanye ngokukhawuleza. Ukudibanisa okuphezulu kukhokelela kuxinano olukhulu lwamandla kunye nokuveliswa kobushushu ngexesha lokusebenza.Ukuba ayichithwanga kakuhle, obu bushushu bunokubangela ukungasebenzi kakuhle kobushushu kwaye bunciphise ixesha lokuphila kwezixhobo ze-elektroniki.
Ukuze kuhlangatyezwane neemfuno ezikhulayo zolawulo lobushushu, izixhobo zokupakisha ze-elektroniki eziphambili ezine-thermal conductivity ephezulu ziyaphandwa kwaye ziphuculwe.
Izinto ezidityanisiweyo zedayimani/zobhedu
01 Idayimani kunye nobhedu
Izinto zokupakisha zemveli ziquka iiceramics, iiplastiki, iimetali, kunye nee-alloys zazo. Iiceramics ezifana neBeO kunye neAlN zibonisa ii-CTEs ezifanayo nee-semiconductors, uzinzo oluhle lweekhemikhali, kunye nokuqhuba kobushushu okuphakathi. Nangona kunjalo, ukucubungula kwazo okuntsonkothileyo, iindleko eziphezulu (ingakumbi iBeO enobuthi), kunye nokungasebenzi kakuhle kwe-brittleness kunciphisa ukusetyenziswa. Ukupakisha kweplastiki kunika iindleko eziphantsi, ubunzima obuphantsi, kunye nokugcina ubushushu buphantsi kodwa kuneengxaki zokuqhuba kobushushu obuphantsi kunye nokungazinzi kobushushu obuphezulu. Iimetali ezicocekileyo (Cu, Ag, Al) zine-conductivity ephezulu yobushushu kodwa i-CTE egqithisileyo, ngelixa ii-alloys (Cu-W, Cu-Mo) ziphazamisa ukusebenza kobushushu. Ke ngoko, izixhobo zokupakisha ezintsha ezilinganisa ukuqhuba kobushushu obuphezulu kunye ne-CTE efanelekileyo zifuneka ngokukhawuleza.
| Uqinisekiso | Ukuqhuba kwe-Thermal (W/(m·K)) | I-CTE (×10⁻⁶/℃) | Uxinano (g/cm³) |
| Idayimani | 700–2000 | 0.9–1.7 | 3.52 |
| Amasuntswana e-BeO | 300 | 4.1 | 3.01 |
| Amasuntswana e-AlN | 150–250 | 2.69 | 3.26 |
| Amasuntswana eSiC | 80–200 | 4.0 | 3.21 |
| Amasuntswana e-B₄C | 29–67 | 4.4 | 2.52 |
| Ifayibha yeBoron | 40 | ~5.0 | 2.6 |
| Amasuntswana e-TiC | 40 | 7.4 | 4.92 |
| Amasuntswana e-Al₂O₃ | 20–40 | 4.4 | 3.98 |
| Iindevu zeSiC | 32 | 3.4 | – |
| Amasuntswana e-Si₃N₄ | 28 | 1.44 | 3.18 |
| Amasuntswana e-TiB₂ | 25 | 4.6 | 4.5 |
| Amasuntswana e-SiO₂ | 1.4 | <1.0 | 2.65 |
Idayimani, eyona nto yendalo inzima kakhulu eyaziwayo (Mohs 10), ikwanazo nezinto ezibalaseleyoukuhanjiswa kobushushu (200–2200 W/(m·K)).
Umgubo omncinci wedayimani
Ithusi, kunye umbane ophezulu oqhuba ubushushu/umbane (401 W/(m·K)), ukuguquguquka, kunye nokusebenza kakuhle kweendleko, zisetyenziswa kakhulu kwii-IC.
Ukudibanisa ezi mpawu,idayimani / ubhedu (Dia / Cu) imidibaniso—kunye neCu njenge-matrix kunye nedayimani njenge-reinforcement—zivela njengezixhobo zolawulo lobushushu zesizukulwana esilandelayo.
02 Iindlela Zokwenza Izinto Eziphambili
Iindlela eziqhelekileyo zokulungiselela idayimani/ubhedu ziquka: i-powder metallurgy, indlela yokushisa okuphezulu kunye noxinzelelo oluphezulu, indlela yokuntywilisela ukunyibilika, indlela yokukhupha i-plasma sintering, indlela yokutshiza ngokubandayo, njl.njl.
Ukuthelekiswa kweendlela ezahlukeneyo zokulungiselela, iinkqubo kunye neempawu zee-composites zedayimani/zobhedu ezinobukhulu besuntswana enye
| Ipharamitha | I-Powder Metallurgy | Umshini wokuCinezela oshushu weVacuum | I-Spark Plasma Sintering (SPS) | Ubushushu obuphezulu obuphezulu (HPHT) | Ukufakwa kweSpray ebandayo | Ukungena kweNyibiliki |
| Uhlobo lweDayimane | MBD8 | I-HFD-D | MBD8 | I-MBD4 | I-PDA | MBD8/HHD |
| I-Matrix | Umgubo we-99.8% Cu | Umgubo we-electrolytic Cu ongu-99.9% | Umgubo we-99.9% Cu | I-alloy/i-Cu powder ecocekileyo | Umgubo weCu ococekileyo | I-Cu ecocekileyo/intonga |
| Uhlengahlengiso loMdibaniso | – | – | – | B, Ti, Si, Cr, Zr, W, Mo | – | – |
| Ubungakanani beParticle (μm) | 100 | 106–125 | 100–400 | 20–200 | 35–200 | 50–400 |
| Iqhekeza Lomthamo (%) | 20–60 | 40–60 | 35–60 | 60–90 | 20–40 | 60–65 |
| Ubushushu (°C) | 900 | 800–1050 | 880–950 | 1100–1300 | 350 | 1100–1300 |
| Uxinzelelo (i-MPa) | 110 | 70 | 40–50 | 8000 | 3 | 1–4 |
| Ixesha (umzuzu) | 60 | 60–180 | 20 | 6–10 | – | 5–30 |
| Uxinano oluhambelanayo (%) | 98.5 | 99.2–99.7 | – | – | – | 99.4–99.7 |
| Ukusebenza | ||||||
| Ukuqhuba okufanelekileyo kobushushu (W/(m·K)) | 305 | 536 | 687 | 907 | – | 943 |
Ubuchule obuqhelekileyo beDia/Cu buquka:
(1)I-Powder Metallurgy
Iipowder zedayimani/Cu ezixutyiweyo ziyacutshungulwa kwaye zifakwe i-sintered. Nangona zingabizi kakhulu kwaye zilula, le ndlela ivelisa uxinano olulinganiselweyo, izakhiwo ezincinci ezingalinganiyo, kunye nobukhulu besampulu obulinganiselweyo.
Siyunithi yokudibanisa
(1)Ubushushu obuphezulu obuphezulu (HPHT)
Ngokusebenzisa ii-multi-anvil presses, i-Cu enyibilikisiweyo ingena kwiilatti zedayimani phantsi kweemeko ezinzima, ivelise ii-composites ezixineneyo. Nangona kunjalo, i-HPHT ifuna ii-molds ezibizayo kwaye ayifanelekanga kwimveliso enkulu.
Ci-ubic press
(1)Ukungena kweNyibiliki
I-Molten Cu ingena kwi-preforms zedayimani ngokufakwa kwe-pressure-assisted okanye i-capillary-driven infiltration. Ii-composites eziphumayo zifikelela kwi->446 W/(m·K) thermal conductivity.
(2)I-Spark Plasma Sintering (SPS)
Umsinga otyhalwayo utshisa ngokukhawuleza iipowder ezixutyiweyo xa uphantsi koxinzelelo. Nangona usebenza kakuhle, ukusebenza kwe-SPS kuyawohloka xa ii-diamond fractions zingaphezulu kwama-65 vol%.
Umzobo wesicwangciso senkqubo yokusila i-plasma yokukhupha
(5) Ukufakwa kweSitshizi esibandayo
Iipowder ziyakhawuleziswa kwaye zibekwe kwi-substrates. Le ndlela intsha ijongene nemingeni kulawulo lokugqitywa komphezulu kunye nokuqinisekiswa kokusebenza kobushushu.
03 Uhlengahlengiso lweSiqhagamshelo
Ukulungiselela izinto ezidityanisiweyo, ukumanzisa phakathi kwezinto kuyimfuneko ebalulekileyo kwinkqubo yokudibanisa kwaye yinto ebalulekileyo echaphazela ulwakhiwo lojongano kunye nemeko yokubopha ujongano. Imeko yokungamanzisi kwindawo yojongano phakathi kwedayimani kunye neCu ikhokelela ekuchaseni okuphezulu kakhulu kojongano lojongano. Ke ngoko, kubaluleke kakhulu ukwenza uphando lokuguqula ujongano phakathi kwezi zimbini ngeendlela ezahlukeneyo zobugcisa. Okwangoku, kukho iindlela ezimbini zokuphucula ingxaki yojongano phakathi kwedayimani kunye neCu matrix: (1) Unyango lokuguqulwa komphezulu wedayimani; (2) Unyango lokudibanisa i-matrix yobhedu.
Umzobo weskimu yokuguqula: (a) Ukugquma ngokuthe ngqo kumphezulu wedayimani; (b) Ukudibanisa i-matrix
(1) Ukuguqulwa komphezulu wedayimani
Ukubeka izinto ezisebenzayo ezifana neMo, Ti, W kunye neCr kumaleko womphezulu wesigaba sokuqinisa kunokuphucula iimpawu ze-interfacial zedayimani, ngaloo ndlela kuphucula ukuhanjiswa kwayo kobushushu. Ukusila kunokwenza izinto ezingentla zikwazi ukusabela nekhabhoni kumphezulu womgubo wedayimani ukuze zenze umaleko wotshintsho lwekhabhoni. Oku kuphucula imeko yokumanzisa phakathi kwedayimani kunye nesiseko sesinyithi, kwaye ugqubuthelo lunokuthintela ulwakhiwo lwedayimani ekutshintsheni kumaqondo obushushu aphezulu.
(2) Ukudibanisa i-matrix yobhedu
Ngaphambi kokuba kuqhutywe izinto ezidityanisiweyo, kwenziwa unyango lokuxuba izinto ngentsimbi, olunokuvelisa izinto ezidityanisiweyo ezine-thermal conductivity ephezulu. Ukufaka izinto ezisebenzayo kwi-copper matrix akunakunciphisa kuphela i-Angle yokumanzisa phakathi kwedayimani kunye nobhedu, kodwa kukwavelisa umaleko we-carbide onyibilikayo kwi-copper matrix kwi-diamond / Cu interface emva kwe-reaction. Ngale ndlela, uninzi lwezithuba ezikhoyo kwi-material interface ziyaguqulwa kwaye zizaliswe, ngaloo ndlela kuphuculwe i-thermal conductivity.
04 Isiphelo
Izixhobo zokupakisha eziqhelekileyo azikwazi ukulawula ubushushu obuvela kwiitships eziphambili. Ii-composites zeDia/Cu, ezine-CTE ehlengahlengiswayo kunye ne-ultrahigh thermal conductivity, zimele isisombululo esiguqulayo kwizixhobo ze-elektroniki zesizukulwana esilandelayo.
Njengeshishini elinobuchwepheshe obuphezulu elidibanisa ishishini kunye norhwebo, i-XKH igxile kuphando nophuhliso kunye nokuveliswa kwezinto ezidityanisiweyo zedayimani/zobhedu kunye nezinto ezidityanisiweyo ze-metal matrix ezisebenza kakuhle ezifana ne-SiC/Al kunye ne-Gr/Cu, ezibonelela ngezisombululo ezintsha zolawulo lobushushu ezinokuqhuba ubushushu obungaphezulu kwe-900W/(m·K) kwiindawo zokupakisha nge-elektroniki, iimodyuli zamandla kunye neenqwelo-moya.
XKH'Izinto ezidityanisiweyo ze-laminate ezenziwe nge-copper clad zedayimani:
Ixesha leposi: Meyi-12-2025