Ngo-1965, umseki we-Intel uGordon Moore wachaza into eyaba "nguMthetho kaMoore." Ngaphezulu kwesiqingatha senkulungwane iye yaxhasa iinzuzo ezizinzileyo ekusebenzeni kwe-integrated-circuit (IC) kunye neendleko ezihlayo-isiseko seteknoloji yedijithali yanamhlanje. Ngamafutshane: inani le-transistors kwi-chip liphindwe kabini rhoqo kwiminyaka emibini.
Kangangeminyaka, inkqubela ibilandelela loo mkhwa. Ngoku umfanekiso uyatshintsha. Ukucutheka ngakumbi kuye kwanzima; Ubukhulu besici buphantsi ukuya kwii-nanometers nje ezimbalwa. Iinjineli zibaleka kwimida yomzimba, amanyathelo enkqubo entsonkothileyo, kunye nokunyuka kweendleko. Iijometri ezincinci nazo zicinezela isivuno, zenza ukuveliswa kwevolumu ephezulu kube nzima. Ukwakha kunye nokusebenza kwelaphu eliphambili kufuna inkunzi enkulu kunye nobuchule. Ngoko ke abaninzi baphikisa ukuba uMthetho kaMoore ulahlekelwa ngumphunga.
Olo tshintsho luvule umnyango wendlela entsha: i-chiplets.
I-chiplet yinto encinci yokufa eyenza umsebenzi othile-ngokubalulekileyo isilayi sento eyayifudula ibe yi-monolithic chip. Ngokudibanisa ii-chiplets ezininzi kwiphakheji enye, abavelisi banokuhlanganisa inkqubo epheleleyo.
Ngexesha le-monolithic, yonke imisebenzi yayihlala kwifa enye enkulu, ngoko ke isiphene naphi na sasinokususa i-chip yonke. Ngama-chiplets, iisistim zakhiwe "kwifa eyaziwayo-elungileyo" (KGD), iphucula ngokumangalisayo isivuno kunye nokusebenza kakuhle.
Ukudibanisa okungafaniyo-ukudibanisa ukufa okwakhiwe kwiindawo ezahlukeneyo zenkqubo kunye nemisebenzi eyahlukeneyo-yenza i-chiplets ibe namandla ngakumbi. Iibhloko ze-computing ezisebenza ngokuphezulu zingasebenzisa ii-nodes zamva nje, ngelixa imemori kunye neesekethe ze-analog zihlala kubuchwephesha obuvuthiweyo, obuneendleko. Isiphumo: ukusebenza okuphezulu ngexabiso eliphantsi.
Ishishini lemoto linomdla kakhulu. Abenzi be-automakers abakhulu basebenzisa obu buchule ukuphuhlisa i-SoCs yemoto yexesha elizayo, kunye nokwamkelwa kobuninzi okujoliswe kuyo emva kwe-2030. Ii-Chiplets zivumela ukuba zilinganise i-AI kunye nemizobo ngokufanelekileyo ngelixa ziphucula isivuno-ukunyusa kokubili ukusebenza kunye nokusebenza kwii-semiconductors zemoto.
Amanye amalungu eemoto kufuneka anelise imigangatho engqongqo yokhuseleko kwaye ke axhomekeke kwiindawo ezindala, eziqinisekisiweyo. Ngeli xesha, iinkqubo zanamhlanje ezifana noncedo lwabaqhubi oluphambili (ADAS) kunye nezithuthi ezichazwe ngesoftware (SDVs) zifuna ikhompyuter engaphezulu. I-Chiplets ibhulorho eso sikhewu: ngokudibanisa i-microcontrollers yeklasi yokhuseleko, imemori enkulu, kunye ne-AI accelerators enamandla, abavelisi banokulungelelanisa ii-SoCs kwiimfuno ze-automaker nganye-ngokukhawuleza.
Ezi zibonelelo zandisa ngaphaya kweemoto. Uyilo lwe-Chiplet lusasazeka kwi-AI, i-telecom, kunye nezinye iindawo, ukukhawulezisa ukuveliswa kwezinto ezintsha kuwo wonke amashishini kwaye ngokukhawuleza ibe yintsika yendlela ye-semiconductor.
Ukudityaniswa kwe-Chiplet kuxhomekeke kwi-compact, i-high-speed die-to-die connections. Isixhobo esiphambili sisilungelelaniso-umaleko ophakathi, odla ngokuba yisilicon, ngaphantsi kwendawo ethumela umqondiso njengebhodi yesekethe encinci. Abangeneleli abangcono bathetha ukudityaniswa okuqinileyo kunye nokutshintshiselana ngophawu olukhawulezayo.
Ukupakishwa okukwinqanaba eliphezulu kwakhona kuphucula ukunikezelwa kwamandla. Uluhlu oluxineneyo loqhagamshelo lwentsimbi oluncinci phakathi kwee-dies lubonelela ngeendlela ezaneleyo zangoku kunye nedatha nakwindawo ezixineneyo, okwenza ugqithiso lwe-bandwidth ephezulu ngelixa kusetyenziswa ngokufanelekileyo indawo yephakheji encinci.
Indlela yanamhlanje ephambili kukudityaniswa kwe-2.5D: ukubeka iifa ezininzi ngapha nangapha kwi-interposer. Ukutsiba okulandelayo kukudityaniswa kwe-3D, ethi izitaki zifa ngokuthe nkqo zisebenzisa i-silicon vias (TSVs) kuxinaniso oluphezulu.
Ukudibanisa uyilo lwe-chip yemodyuli (ukwahlula imisebenzi kunye neentlobo zesekethe) kunye ne-3D yokupakisha isivuno ngokukhawuleza, encinci, i-semiconductors eyonga amandla. I-co-locating memory kunye ne-computing ihambisa i-bandwidth enkulu kwii-datasets ezinkulu-ezilungele i-AI kunye neminye imisebenzi ephezulu yokusebenza.
Ukupakisha ngokuthe nkqo, nangona kunjalo, kuzisa imingeni. Ubushushu buqokelelana ngokulula ngakumbi, lunzima ulawulo lwe-thermal kunye nesivuno. Ukujongana noku, abaphandi baqhubela phambili iindlela zokupakisha ezintsha zokuphatha ngcono izithintelo ze-thermal. Nangona kunjalo, umfutho unamandla: ukuhlangana kwee-chiplets kunye nokuhlanganiswa kwe-3D kubonwa ngokubanzi njengeparadigm ephazamisayo-ilungele ukuthwala itotshi apho uMthetho kaMoore ushiya khona.
Ixesha lokuposa: Oct-15-2025