Yintoni i-TGV?
TGV, (Nge-Glass nge), iteknoloji yokwenza imingxunya edlulayo kwisiseko seglasi, Ngamafutshane, i-TGV sisakhiwo esiphakamileyo esibhoboza, sizalise kwaye sidibanise phezulu nasezantsi iglasi ukuze sakhe iisekethe ezidibeneyo kumgangatho weglasi. Le teknoloji ithathwa njengeteknoloji ebalulekileyo kwisizukulwana esilandelayo sokupakisha kwe-3D.
Zithini iimpawu ze-TGV?
1. Ulwakhiwo: I-TGV yi-conductive edlula ngokuthe nkqo engene ngaphakathi kwi-substrate yeglasi. Ngokubeka umaleko wesinyithi oqhubayo eludongeni lwe-pore, iileya eziphezulu nezisezantsi zemiqondiso yombane ziyadityaniswa.
2. Inkqubo yokuvelisa: Ukuveliswa kwe-TGV kubandakanya ulungiso lwangaphambi kwe-substrate, ukwenza imingxunya, ukubeka umaleko wesinyithi, ukuzaliswa kwemingxunya kunye namanyathelo okusila. Iindlela eziqhelekileyo zokuvelisa kukugrumba ngamakhemikhali, ukubhola nge-laser, ukuplata nge-electroplating njalo njalo.
3. Iingenelo zokusetyenziswa: Xa kuthelekiswa nentsimbi yendabuko edlulayo, i-TGV ineengenelo zobukhulu obuncinci, uxinano oluphezulu lweentambo, ukusebenza ngcono kokusasaza ubushushu njalo njalo. Isetyenziswa kakhulu kwi-microelectronics, optoelectronics, MEMS nakwezinye iindawo zonxibelelwano oluxineneyo.
4. Indlela yophuhliso: Njengoko iimveliso ze-elektroniki ziphuhliswa zisiya kwi-miniaturization kunye nokudibanisa okuphezulu, itekhnoloji ye-TGV ifumana ingqwalasela kunye nokusetyenziswa okungakumbi. Kwixesha elizayo, inkqubo yayo yokuvelisa iya kuqhubeka iphuculwa, kwaye ubungakanani bayo kunye nokusebenza kwayo kuya kuqhubeka kuphucuka.
Yintoni inkqubo ye-TGV:
1. Ukulungiswa kwe-substrate yeglasi (a): Lungisa i-substrate yeglasi ekuqaleni ukuqinisekisa ukuba umphezulu wayo uthambile kwaye ucocekile.
2. Ukubhoboza ngeglasi (b): I-laser isetyenziselwa ukwenza umngxuma wokungena kwi-substrate yeglasi. Imilo yomngxuma idla ngokuba yi-conical, kwaye emva konyango nge-laser kwelinye icala, iyajikwa ize icutshungulwe kwelinye icala.
3. Ukwenziwa kwesinyithi eludongeni lwemingxunya (c): Ukwenziwa kwesinyithi kwenziwa eludongeni lwemingxunya, ngesiqhelo ngePVD, CVD kunye nezinye iinkqubo zokwenza umaleko wembewu yesinyithi oqhubayo eludongeni lwemingxunya, njengeTi/Cu, Cr/Cu, njl.njl.
4. I-Lithography (d): Umphezulu we-substrate yeglasi ugqunywe nge-photoresist kwaye une-photopattern. Veza iindawo ezingadingi plating, ukuze kuphela iindawo ezifuna plating ezivezwayo.
5. Ukuzaliswa kwemingxunya (e): Ukufaka ubhedu nge-electroplating ukuze kuzaliswe iglasi ngemingxunya ukuze kwenziwe indlela epheleleyo yokuhambisa amanzi. Ngokuqhelekileyo kufuneka ukuba umngxunya uzaliswe ngokupheleleyo kungabikho mingxunya. Qaphela ukuba i-Cu kumzobo ayizaliswanga ngokupheleleyo.
6. Umphezulu othe tyaba we-substrate (f): Ezinye iinkqubo ze-TGV ziya kuwenza umphezulu we-substrate yeglasi ezeleyo uqine ukuqinisekisa ukuba umphezulu we-substrate uthambile, nto leyo ehambelana namanyathelo enkqubo alandelayo.
7. Umaleko wokukhusela kunye noqhagamshelo lwesiphelo (g): Umaleko wokukhusela (ofana ne-polyimide) wenziwa phezu komphezulu wesiseko seglasi.
Ngamafutshane, inyathelo ngalinye lenkqubo ye-TGV libalulekile kwaye lifuna ulawulo oluchanekileyo kunye nokwenza ngcono. Okwangoku sinikezela ngetekhnoloji yeglasi ye-TGV ngokusebenzisa imingxunya ukuba kuyimfuneko. Nceda uzive ukhululekile ukuqhagamshelana nathi!
(Olu lwazi lungasentla luvela kwi-intanethi, lucwangcisa)
Ixesha leposi: Juni-25-2024