Isihloko: Yintoni i-FOUP kwi-Chip Manufacturing?

Isiqulatho

1. Isishwankathelo kunye nemisebenzi ephambili ye-FOUP

2.​​Iimpawu zolwakhiwo kunye noyilo lwe-FOUP​

3. Izikhokelo zoHlelo kunye neNkqubo yeFOUP

4. Imisebenzi kunye nokubaluleka kwe-FOUP kwiMveliso yeeSemiconductor​

5.​Imingeni yoBugcisa kunye neendlela zoPhuhliso lweXesha elizayo​

Izisombululo ezenzelwe wena ze-6.XKH kunye neNkxaso yeNkonzo​

Kwinkqubo yokwenziwa kwe-semiconductor, i-Front Opening Unified Pod (FOUP) sisikhongozeli esibalulekileyo esisetyenziselwa ukukhusela, ukuthutha, kunye nokugcina ii-wafers. Ingaphakathi layo linokuthwala iziqwenga ezingama-25 zee-wafers ezingama-300mm, kwaye izinto zayo eziphambili ziquka isikhongozeli sokuvula ngaphambili kunye nesakhelo somnyango esikhethekileyo sokuvula nokuvala. I-FOUP sisithwali esiphambili kwinkqubo yokuthutha ezenzekelayo ngaphakathi kwe-wafer fabs eziyi-12 intshi. Ihlala ithuthwa ivaliwe kwaye ivuleka kuphela xa ityhalelwa kwi-port yomthwalo wezixhobo, ivumela ii-wafers ukuba zidluliselwe kwi-port yokulayisha/yokukhulula izixhobo.

Uyilo lwe-FOUP lulungelelaniswe neemfuno zendalo esingqongileyo. Ineendawo ezingasemva zokufaka i-wafer, kwaye isiciko senzelwe ngokukodwa ukuhambelana ne-clamp yesivuli. Iirobhothi eziphatha i-wafer zisebenza kwindawo yomoya ococekileyo yeKlasi 1, ziqinisekisa ukuba ii-wafer azingcoliswanga ngexesha lokudluliselwa. Ngaphezu koko, i-FOUP ishukunyiswa phakathi kwezixhobo zenkqubo ngenkqubo yokuphatha izinto ezenzekelayo (AMHS). Ii-wafer fabs zanamhlanje zisebenzisa kakhulu iinkqubo zesitimela eziphezulu zokuthutha, ngelixa ezinye ii-wafer ezindala zingasebenzisa izithuthi ezilawulwayo ezisekelwe emhlabeni (ii-AGV).

I-FOUP ayivumeli nje kuphela ukudluliselwa kwe-wafer ngokuzenzekelayo kodwa ikwasebenza nomsebenzi wokugcina. Ngenxa yamanyathelo amaninzi okuvelisa, ii-wafers zingathatha iinyanga ukugqiba yonke inkqubo. Xa zidityaniswe nomthamo ophezulu wemveliso yenyanga, oku kuthetha ukuba amashumi amawaka ee-wafers ngaphakathi kwento nganye zihlala zithuthwa okanye zigcinwa okwethutyana nangaliphi na ixesha. Ngexesha lokugcina, ii-FOUPs zihlanjululwa rhoqo nge-nitrogen ukuthintela ukungcola ukuba kungadibani nee-wafers, ukuqinisekisa inkqubo yemveliso ecocekileyo nethembekileyo.

1. Imisebenzi kunye nokubaluleka kwe-FOUP

Umsebenzi ophambili we-FOUP kukukhusela ii-wafers kwi-external shock kunye nongcoliseko, ingakumbi ukuthintela impembelelo kwimveliso ngexesha lokudluliselwa. Ithintela ngokufanelekileyo umswakama ngeendlela ezifana nokucoca igesi kunye noLawulo lweNdawo yoMmandla (i-LAC), ukuqinisekisa ukuba ii-wafers zihlala zikwimeko ekhuselekileyo ngelixa zilinde inyathelo elilandelayo lokuvelisa. Inkqubo yayo evaliweyo nelawulwayo ivumela kuphela iikhompawundi kunye nezinto ezifunekayo ukuba zingene, nto leyo enciphisa kakhulu imiphumo emibi ye-VOCs, ioksijini, kunye nokufuma kwii-wafers.

Ekubeni i-FOUP egcwele ngokupheleleyo ii-wafers ezingama-25 inobunzima obufikelela kwiikhilogram ezili-9, ukuthuthwa kwayo kufuneka kuxhomekeke kwiNkqubo yoLawulo lweZinto eziZenzekelayo (i-AMHS). Ukuze kube lula oku, i-FOUP yenzelwe iintlobo ngeentlobo zeepleyiti zokudibanisa, iiphini, kunye nemingxunya, kwaye ixhotyiswe ngeethegi ze-RFID ze-elektroniki ukuze kube lula ukuchongwa nokuhlelwa. Olu lawulo oluzenzekelayo alufuni phantse ukusebenza ngesandla, nto leyo enciphisa kakhulu amazinga eempazamo kwaye iphucula ukhuseleko kunye nokuchaneka kwenkqubo yokuvelisa.

2. Ulwakhiwo kunye noHlelo lwe-FOUP

Ubukhulu obuqhelekileyo be-FOUP bumalunga ne-420 mm ububanzi, i-335 mm ubunzulu, kunye ne-335 mm ukuphakama. Izinto eziphambili zokwakha zayo ziquka: i-OHT ephezulu (intloko yekhowa) yokuthutha i-hoist ephezulu; ucango lwangaphambili lokufikelela kwi-wafer yezixhobo; Iziphatho ezisecaleni, ezihlala zinemibala yokwahlula iindawo zenkqubo ezinamazinga ahlukeneyo okungcola; indawo yekhadi yokubeka amakhadi emiyalezo; kunye nethegi ye-RFID esezantsi esebenza njengesihlonzi esahlukileyo se-FOUP, evumela izixhobo kunye nee-hoist eziphezulu ukuba ziyibone. Isiseko sikwaxhotyiswe ngemingxuma emine yokuchonga kunye nokubeka indawo yokufanisa nezixhobo kunye neendawo zenkqubo zokwahlulahlula.

Ngokusekelwe ekusetyenzisweni, ii-FOUP zahlulwe zibe ziintlobo ezintathu: i-PRD (yemveliso), i-ENG (yee-wafers zobunjineli), kunye ne-MON (yee-wafers zemonitha). Ii-PRD FOUPs zingasetyenziselwa ukwenziwa kwemveliso, iintlobo ze-ENG zifanelekile kwi-R&D okanye kwi-experiments, kwaye iintlobo ze-MON zizinikele ekujongeni inkqubo yamanyathelo afana ne-CMP kunye ne-DIFF. Kubalulekile ukuqaphela ukuba ii-PRD FOUPs zingasetyenziselwa zombini iinjongo ze-ENG kunye ne-MON, kwaye iintlobo ze-ENG zingasetyenziselwa i-MON, kodwa ukusebenza ngasemva kuzisa umngcipheko womgangatho.

Zihlelwe ngokwenqanaba longcoliseko, ii-FOUP zingahlulwa zibe yi-FE FOUP (inkqubo yangaphambili, engenasinyithi), i-BE FOUP (inkqubo yangasemva, equlethe isinyithi), kunye nezo zikhethekileyo kwiinkqubo ezithile zesinyithi ezifana ne-NI FOUP, i-CU FOUP, kunye ne-CO FOUP. Ii-FOUP zeenkqubo ezahlukeneyo zihlala zahlulwa ngombala weziphatho ezisecaleni okanye iiphaneli zeminyango. Ii-FOUP ezivela kwiinkqubo zangaphambili zingasetyenziswa kwiinkqubo zangasemva, kodwa ii-FOUP zangasemva akufuneki zisetyenziswe kwiinkqubo zangaphambili, njengoko oku kunokubangela umngcipheko wongcoliseko.

Njengenkampani ephambili ekuveliseni ii-semiconductor, i-FOUP, ngokusebenzisa i-automation ephezulu kunye nolawulo oluqinileyo longcoliseko, iqinisekisa ukhuseleko kunye nokucoceka kwee-wafers ngexesha lenkqubo yemveliso, nto leyo eyenza ukuba ibe sisiseko esibalulekileyo kwii-wafer fabs zanamhlanje.

Isiphelo

I-XKH izibophelele ekuboneleleni abathengi ngezisombululo ze-Front-Opening Unified Pod (FOUP) ezenzelwe wena kakhulu, zinamathela ngokungqongqo kwiimfuno zakho zenkqubo ethile kunye neenkcukacha zomdibaniso wezixhobo. Sisebenzisa iteknoloji yezinto eziphucukileyo kunye neenkqubo zokwenza ngokuchanekileyo, siqinisekisa ukuba yonke imveliso ye-FOUP inika umoya oqinileyo, ucoceko, kunye nozinzo loomatshini. Iqela lethu lobuchwephesha linolwazi olunzulu kushishino, linikezela ngenkxaso epheleleyo yomjikelo wobomi—ukusuka kwingcebiso yokukhetha kunye nokwenza ngcono ulwakhiwo ukuya ekucoceni nasekugcinweni—ukuqinisekisa ukuhlanganiswa okungenamthungo kunye nentsebenziswano esebenzayo phakathi kwe-FOUP kunye neNkqubo yakho yoLawulo lweZinto eziZenzekelayo (AMHS) kunye nezixhobo zokucubungula. Sihlala sibeka phambili ukhuseleko lwee-wafers kunye nokuphucula isivuno semveliso njengeenjongo zethu eziphambili. Ngeemveliso ezintsha kunye neenkonzo zobugcisa eziquka yonke into, sinikezela ngesiqinisekiso esomeleleyo kwiinkqubo zakho zokuvelisa ze-semiconductor, ekugqibeleni siphucula ukusebenza kakuhle kwemveliso kunye nesivuno semveliso.